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cavity filter

A cavity filter and cavity technology, applied to waveguide devices, circuits, electrical components, etc., can solve the problems of poor mechanical properties, coarse crystal grains, and cavity filters that are not conducive to transportation, installation and disassembly, and achieve Effects of reduced raw material cost, easy assembly, enhanced mechanical properties and thermal conductivity

Active Publication Date: 2019-05-10
SHENZHEN WAVE TELECOMM TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the high density of aluminum, copper or aluminum alloy, the weight of the cavity filter made of it is also relatively large, which makes the cavity filter unfavorable for transportation, installation and disassembly. The bracket also has higher requirements
[0004] Nowadays, the traditional die-casting process is usually used to prepare the cavity filter cavity and cover plate. Due to the defects of the process itself, there are often defects such as pores, shrinkage cavities, slag inclusions, and segregation in the product, and due to the effect of high temperature, the grains are coarse and mechanical poor performance

Method used

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0054] The specific implementation steps are as follows:

[0055] Step 1. Prepare metal powder raw materials: use magnesium powder, samarium powder, zirconium powder, and silver powder with an average particle size of 5-10 μm as raw materials, and according to the weight percentage of each component: magnesium 95.4%, samarium 3.5%, zirconium 1.0%, Silver 0.1%, calculation Weigh each metal powder raw material and mix.

[0056] Step 2, prepare the binder: use a banbury mixer, set the banbury temperature to 180°C, and set the percentage by weight: 50% paraffin wax (PW), 45% high-density polyethylene (HDPE) and 5% stearic acid (SA) The high-molecular components were added into the mixer in sequence according to the melting point, banburying for 2 hours, and cooling to prepare the mixed binder.

[0057] Step 3: Use a kneader, set the kneading temperature to 160°C, add metal powder mixed raw materials and mixed binders with a volume fraction ratio of 3:2 into the barrel of the knea...

Embodiment 2

[0066] The specific implementation steps are as follows:

[0067] Step 1. Prepare metal powder raw materials: use magnesium powder, samarium powder, zirconium powder, silver and / or zinc powder with an average particle size of 5-10 μm as raw materials, and according to the weight percentage of each component: magnesium 96.7%, samarium 3% , zirconium 0.2%, zinc 0.08%, calculate and weigh each metal powder raw material and mix.

[0068] Step 2, prepare binder: adopt banbury mixer, set banbury temperature 175 ℃, the percentage by weight is: 52% paraffin (PW), 43% high-density polyethylene (HDPE) and 5% stearic acid (SA) The high-molecular components were added to the mixer in sequence according to the melting point, banburying for 2.2 hours, and cooling to prepare a mixed binder.

[0069] Step 3: Use a kneader, set the kneading temperature to 165°C, add metal powder mixed raw materials and mixed binders with a volume fraction ratio of 3:2 into the barrel of the kneader in turn, a...

Embodiment 3

[0078] The specific implementation steps are as follows:

[0079] Step 1. Prepare metal powder raw materials: use magnesium powder, samarium powder, zirconium powder, silver and / or zinc powder with an average particle size of 5-10 μm as raw materials, and according to the weight percentage of each component: magnesium 97%, samarium 2.5% , zirconium 0.4%, silver 0.05%, zinc 0.05%, calculate and weigh each metal powder raw material and mix.

[0080] Step 2, prepare the binder: use a banbury mixer, set the banbury temperature to 170°C, and the percentage by weight is: 53% paraffin wax (PW), 42% high-density polyethylene (HDPE) and 5% stearic acid (SA) The high-molecular components were added to the mixer in sequence according to the melting point, banburying for 2.5 hours, and cooling to prepare a mixed binder.

[0081] Step 3: Use a kneader, set the kneading temperature to 170°C, add metal powder mixed raw materials and mixed binders with a volume fraction ratio of 3:2 into the...

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Abstract

The invention provides a cavity filter including a cavity, a cover plate and a resonant rod. The cavity and the cover plate are combined to form an enclosed resonant cavity. The resonant rod is mounted in the cavity. The cavity and the cover plate are produced from metal powder through an injection molding technique. As the cavity and the cover plate are produced from metal powder through the injection molding technique, the mechanical performance and heat conduction performance of the cavity filter are enhanced, the material cost of the filter is reduced greatly, and the cavity filter is easy to assemble and manufacture.

Description

technical field [0001] The invention relates to the technical field of microwave communication, in particular to a cavity filter. Background technique [0002] In a base station system for mobile communications, a communication signal carrying communication data within a specific frequency range is usually transmitted through a transmitting antenna, and the communication signal is received through a receiving antenna. The signal received by the receiving antenna includes not only communication signals carrying communication data within the above-mentioned specific frequency range, but also many clutter or interference signals outside the above-mentioned specific frequency range. In order to obtain a communication signal carrying communication data within a specific frequency range transmitted by the transmitting antenna from the signal received by the receiving antenna, it is usually necessary to filter the signal received by the receiving antenna through a filter to specify...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01P1/207H01P11/00
CPCH01P1/207H01P11/007
Inventor 庄健郭浩张少林王恩东
Owner SHENZHEN WAVE TELECOMM TECH CO LTD