A kind of single polyethylene composite packaging material and preparation method thereof
A composite packaging material, polyethylene technology, applied in packaging, packaged food, household packaging, etc., can solve the problem that the repeated application value of the material cannot be fully utilized, the melting point and crystallization temperature are very different, and the scope of reuse Limitations and other issues, to achieve the effect of exquisite printing patterns, easy recycling, and good physical properties
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0021] The single polyethylene composite packaging material is composed of a heat-sealing layer and a surface printing layer; the heat-sealing layer is a blended modified body of metallocene PE and low-density polyethylene LDPE in a weight ratio of 1:0.5; The bonding layer is a modified blend of linear low-density polyethylene LLDPE and low-density polyethylene LDPE in a weight ratio of 1:1.5; a solvent-free adhesive is coated between the heat-sealing layer and the surface printing layer. Among them, the metallocene PE in the heat-sealing layer is produced by Dow, the model is PT1450; the low-density polyethylene LDPE is produced by Exxon, the model is LD150AC; the surface printing layer is linear low-density polyethylene LLDPE, produced by Exxon, the model is LL1004YB, low-density polyethylene LDPE produced by Exxon Company, the model is LD151BW; solvent-free adhesive produced by Henkel Company, the model is Liofol UR 7735.
[0022] Preparation:
[0023] (1) Preparation of t...
Embodiment 2
[0028] The single polyethylene composite packaging material is composed of a heat-sealing layer and a surface printing layer; the heat-sealing layer is a blended modified body of metallocene PE and low-density polyethylene LDPE in a weight ratio of 1:0.6; The bonding layer is a modified blend of linear low-density polyethylene LLDPE and low-density polyethylene LDPE in a weight ratio of 1:1.6; a solvent-free adhesive is coated between the heat-sealing layer and the surface printing layer. Among them, the metallocene PE in the heat-sealing layer is produced by Dow, the model is PT1450; the low-density polyethylene LDPE is produced by Exxon, the model is LD150AC; the surface printing layer is linear low-density polyethylene LLDPE, produced by Exxon, the model is LL1004YB, low-density polyethylene LDPE produced by Exxon Company, the model is LD151BW; solvent-free adhesive produced by Henkel Company, the model is Liofol UR 7735.
[0029] Preparation:
[0030] (1) Preparation of t...
Embodiment 3
[0035] The single polyethylene composite packaging material is composed of a heat-sealing layer and a surface printing layer; the heat-sealing layer is a blended modified body of metallocene PE and low-density polyethylene LDPE in a weight ratio of 1:0.7; The bonding layer is a modified blend of linear low-density polyethylene LLDPE and low-density polyethylene LDPE in a weight ratio of 1:1.7; a solvent-free adhesive is coated between the heat-sealing layer and the surface printing layer. Among them, the metallocene PE in the heat-sealing layer is produced by Dow, the model is PT1450; the low-density polyethylene LDPE is produced by Exxon, the model is LD150AC; the surface printing layer is linear low-density polyethylene LLDPE, produced by Exxon, the model is LL1004YB, low-density polyethylene LDPE produced by Exxon Company, the model is LD151BW; solvent-free adhesive produced by Henkel Company, the model is Liofol UR 7735.
[0036] Preparation:
[0037](1) Preparation of th...
PUM
Property | Measurement | Unit |
---|---|---|
strength | aaaaa | aaaaa |
strength | aaaaa | aaaaa |
strength | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com