Systems and methods for internal surface conditioning assessment in plasma processing equipment

Abstract

In an embodiment, a plasma source includes a first electrode, configured for transfer of one or more plasma source gases through first perforations therein; an insulator, disposed in contact with the first electrode about a periphery of the first electrode; and a second electrode, disposed with a periphery of the second electrode against the insulator such that the first and second electrodes and the insulator define a plasma generation cavity. The second electrode is configured for movement of plasma products from the plasma generation cavity therethrough toward a process chamber. A power supply provides electrical power across the first and second electrodes to ignite a plasma with the one or more plasma source gases in the plasma generation cavity to produce the plasma products. One of the first electrode, the second electrode and the insulator includes a port that provides an optical signal from the plasma.

Description

technical field [0001] The present disclosure is broadly applicable to the field of plasma processing equipment. More specifically, systems and methods for internal surface conditioning evaluation of plasma generators using optical emission spectroscopy are disclosed. Background technique [0002] Semiconductor processing often utilizes plasma processing to etch, clean or deposit materials on semiconductor wafers. Predictable and reproducible wafer processing is facilitated by stable and well-controlled plasma processing parameters. Certain changes to equipment and / or materials involved in plasma processing can temporarily destabilize plasma processing. Such temporary destabilization of plasma processing typically occurs when such changes affect the surface chemistry of plasma system components compared to surface chemistry produced by long-term use in a single process. For example, plasma chamber components may require adjustment upon first use or after the chamber is ev...

AI Technical Summary

Problems solved by technology

Certain changes to equipment and / or materials involved in plasma processing can temporarily destabilize plasma processing

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