Preparation method of copper-oxide-modified epoxide-resin-matrix active carbon

An epoxy resin, copper oxide technology, applied in chemical instruments and methods, inorganic chemistry, carbon compounds, etc., can solve the problems of reduced microporosity, long time, and high cost, and achieve the effect of improving pore structure characteristics

Active Publication Date: 2017-08-22
SHANDONG UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method takes advantage of the characteristics of microwave heating from the inside to the outside and the different absorbing effects of different substances. The water in the copper nitrate solution on the activated carbon is quickly evaporated, the copper nitrate is rapidly polycondensed and crystallized, and the copper oxide load is quickly decomposed on the surface of the activated ...

Method used

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  • Preparation method of copper-oxide-modified epoxide-resin-matrix active carbon
  • Preparation method of copper-oxide-modified epoxide-resin-matrix active carbon

Examples

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Effect test

Embodiment 1

[0033] A preparation method of copper oxide modified epoxy resin-based activated carbon, the steps are as follows:

[0034] (1) After crushing the non-metallic objects in the waste circuit, pass through a 40-mesh screen;

[0035] (2) Add H with a mass concentration of 45% to the waste circuit board powder 3 PO 4 The solution, ultrasonically mixed, let stand for 3-5min, then add 0.2g copper oxide and mix well to obtain a mixture; ultrasonicate the mixture in an ultrasonic water bath for 40min, the ultrasonic power is 200W, and then place it at 30 ℃ for 10 hours immersion; waste circuit The amount of board powder added and H 3 PO 4 The mass ratio of the solution is 1:2 (g / g); the mass ratio of the added amount of copper oxide to the waste circuit board powder is: 0.05:1;

[0036](3) The impregnated mixture in step (2) is placed in a tubular heating furnace. Under air protection, the temperature is raised to 350°C at a heating rate of 7°C / min, activated at 350°C for 35min, an...

Embodiment 2

[0039] A preparation method of copper oxide modified epoxy resin-based activated carbon, the steps are as follows:

[0040] (1) After crushing the non-metallic objects in the waste circuit, pass through a 100-mesh sieve;

[0041] (2) adding mass concentration to waste circuit board powder is 55% H 3 PO 4 Solution, ultrasonically mixed, let stand for 3-5min, then add 0.35g of copper oxide and mix to obtain a mixture; ultrasonicate the mixture in an ultrasonic water bath for 60min, the ultrasonic power is 300W, and then place it at 45°C for 15 hours; waste circuit The amount of plate powder added and H 3 PO 4 The mass ratio of the solution is 1:3 (g / g); the mass ratio of the amount of copper oxide added to the waste circuit board powder is: 0.35:1;

[0042] (3) The impregnated mixture in step (2) is placed in a tubular heating furnace. Under air protection, the temperature is raised to 475°C at a heating rate of 15°C / min, activated at 475°C for 55min, and the rate of air int...

Embodiment 3

[0045] A preparation method of copper oxide modified epoxy resin-based activated carbon, the steps are as follows:

[0046] (1) After crushing the non-metallic objects in the waste circuit, pass through a 60-mesh sieve;

[0047] (2) adding mass concentration to waste circuit board powder is 50% H 3 PO 4 Solution, ultrasonically mixed, let stand for 3-5min, then add 0.4g of copper oxide and mix to obtain a mixture; ultrasonicate the mixture in an ultrasonic water bath for 60min, the ultrasonic power is 400W, and then place it at 80°C for 10 hours; waste circuit The amount of plate powder added and H 3 PO 4 The mass ratio of the solution is 1:4 (g / g); the mass ratio of the amount of copper oxide added to the waste circuit board powder is: 0.4:1;

[0048] (3) The impregnated mixture in step (2) is placed in a tubular heating furnace. Under air protection, the temperature is raised to 625°C at a heating rate of 20°C / min, activated at 625°C for 100min, and the air flow rate is ...

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Abstract

The invention relates to a preparation method of copper-oxide-modified epoxide-resin-matrix active carbon. The method includes the steps of adding a H3PO4 solution into powder of waste circuit boards to form a mixture, utilizing ultrasound to blend the mixture evenly, remaining the mixture still for 3-5 min, and adding copper oxide into the mixture and blending the mixture evenly to obtain a final mixture; conducting ultrasonic treatment on the mixture for 40-80 min, dipping the mixture under a temperature of 30-60 DEG C for 10-22 h; roasting the mixture after dipping under the protection of nitrogen, grinding and sifting the mixture after washing and drying, then obtaining the copper-oxide-modified epoxide-resin-matrix active carbon. By adding copper oxide to catalyze decomposition of carbon precursor during the process of phosphoric acid dipping, the preparation method of copper-oxide-modified epoxide-resin-matrix active carbon has the advantages of accelerating the bond breaking in organic matter such as the dissociation of terminal carbon-carbon double bond in hydrocarbon, accelerating the process of catalytic reaction, and achieving the augment of a new functional group (P-C, PO3, C-O-H) on the surface of the obtained active carbon, wherein the specific surface area of the obtained active carbon is big, and the proportion of micropore is high.

Description

technical field [0001] The invention relates to a preparation method of copper oxide modified epoxy resin-based activated carbon, and belongs to the technical field of activated carbon preparation. Background technique [0002] Activated carbon is black powder or block, granular, honeycomb amorphous carbon, as well as regular crystalline carbon. Due to its strong adsorption, stable chemical properties, acid and alkali resistance, insoluble in water, and regenerable, it is widely used in chemical, environmental protection and other fields. Activated carbon has a wide range of raw materials, and most of the carbon-rich organic materials can be used as raw materials for the preparation of activated carbon. Printed circuit boards are composite materials composed of epoxy resin, fiberglass, and high-purity copper. At present, the metal parts of waste circuit boards can be effectively recovered by mechanical separation, but the non-metallic powder produced in the process of mech...

Claims

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Application Information

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IPC IPC(8): C01B32/342C01B32/324C01B32/348B01J20/20B01J20/30
CPCB01J20/06B01J20/20B01J2220/4887C01P2002/80C01P2002/82C01P2004/03C01P2006/12C01P2006/17
Inventor 高宝玉阚渝姣岳钦艳
Owner SHANDONG UNIV
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