Preparation method of copper-oxide-modified epoxide-resin-matrix active carbon
An epoxy resin, copper oxide technology, applied in chemical instruments and methods, inorganic chemistry, carbon compounds, etc., can solve the problems of reduced microporosity, long time, and high cost, and achieve the effect of improving pore structure characteristics
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Embodiment 1
[0033] A preparation method of copper oxide modified epoxy resin-based activated carbon, the steps are as follows:
[0034] (1) After crushing the non-metallic objects in the waste circuit, pass through a 40-mesh screen;
[0035] (2) Add H with a mass concentration of 45% to the waste circuit board powder 3 PO 4 The solution, ultrasonically mixed, let stand for 3-5min, then add 0.2g copper oxide and mix well to obtain a mixture; ultrasonicate the mixture in an ultrasonic water bath for 40min, the ultrasonic power is 200W, and then place it at 30 ℃ for 10 hours immersion; waste circuit The amount of board powder added and H 3 PO 4 The mass ratio of the solution is 1:2 (g / g); the mass ratio of the added amount of copper oxide to the waste circuit board powder is: 0.05:1;
[0036](3) The impregnated mixture in step (2) is placed in a tubular heating furnace. Under air protection, the temperature is raised to 350°C at a heating rate of 7°C / min, activated at 350°C for 35min, an...
Embodiment 2
[0039] A preparation method of copper oxide modified epoxy resin-based activated carbon, the steps are as follows:
[0040] (1) After crushing the non-metallic objects in the waste circuit, pass through a 100-mesh sieve;
[0041] (2) adding mass concentration to waste circuit board powder is 55% H 3 PO 4 Solution, ultrasonically mixed, let stand for 3-5min, then add 0.35g of copper oxide and mix to obtain a mixture; ultrasonicate the mixture in an ultrasonic water bath for 60min, the ultrasonic power is 300W, and then place it at 45°C for 15 hours; waste circuit The amount of plate powder added and H 3 PO 4 The mass ratio of the solution is 1:3 (g / g); the mass ratio of the amount of copper oxide added to the waste circuit board powder is: 0.35:1;
[0042] (3) The impregnated mixture in step (2) is placed in a tubular heating furnace. Under air protection, the temperature is raised to 475°C at a heating rate of 15°C / min, activated at 475°C for 55min, and the rate of air int...
Embodiment 3
[0045] A preparation method of copper oxide modified epoxy resin-based activated carbon, the steps are as follows:
[0046] (1) After crushing the non-metallic objects in the waste circuit, pass through a 60-mesh sieve;
[0047] (2) adding mass concentration to waste circuit board powder is 50% H 3 PO 4 Solution, ultrasonically mixed, let stand for 3-5min, then add 0.4g of copper oxide and mix to obtain a mixture; ultrasonicate the mixture in an ultrasonic water bath for 60min, the ultrasonic power is 400W, and then place it at 80°C for 10 hours; waste circuit The amount of plate powder added and H 3 PO 4 The mass ratio of the solution is 1:4 (g / g); the mass ratio of the amount of copper oxide added to the waste circuit board powder is: 0.4:1;
[0048] (3) The impregnated mixture in step (2) is placed in a tubular heating furnace. Under air protection, the temperature is raised to 625°C at a heating rate of 20°C / min, activated at 625°C for 100min, and the air flow rate is ...
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