Modified AHP based on epoxy-silicone resin prepolymer microencapsulation and preparation method and application thereof
An epoxy silicone resin, microencapsulation technology, applied in the direction of dyeing organosilicon compound treatment, fibrous filler, etc., can solve the problems of large equipment investment, high production cost, unfavorable uniform dispersion and processing, etc., and achieve excellent flame retardant performance. , reduce flame retardant properties, improve the effect of anti-aging
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Embodiment 1
[0040]This embodiment provides a method for preparing AHP based on microencapsulation modification of epoxy silicone resin prepolymer, including:
[0041] (1) Preparation of epoxy silicone resin prepolymer: take 500g bisphenol A type epoxy resin E 44 , use a small kneader to stir and heat to 90°C to make it have excellent fluidity, use a watering can to spray 300g of methylphenyl silicone resin intermediate IC368 into the kneader while stirring, and then add 16g of butyl titanate as Catalyst, react at 90°C for 1 hour, then raise the temperature to about 135°C for 3-4 hours, and obtain a milky white translucent viscous epoxy silicone resin prepolymer;
[0042] After the synthetic epoxy-silicon prepolymer was left to stand at room temperature and cooled to room temperature, after washing off the low-molecular-weight organic matter on the surface of the epoxy-silicon prepolymer with 600ml water (equally divided 3 times) and 200ml ethanol (equally divided 2 times), After the expe...
Embodiment 2
[0045] This embodiment provides a method for preparing AHP based on microencapsulation modification of epoxy silicone resin prepolymer, including:
[0046] (1) Preparation of epoxy silicone resin prepolymer: with reference to the steps of Example 1;
[0047] (2) Preparation of modified AHP: Weigh 1000g of AHP, add it to a small kneader, stir at high speed, heat up to 90°C, then weigh 45g of epoxy silicone resin prepolymer and 5g of 2-ethyl-4 methylimidazole , after heating to 90°C, use a watering can to spray on the high-speed stirring AHP, and heat up to 150°C-170°C and then cure for 3 hours to obtain microencapsulated modified AHP based on epoxy silicone resin prepolymer, marked as 5% ESi-AHP.
Embodiment 3
[0049] This embodiment provides a method for preparing AHP based on microencapsulation modification of epoxy silicone resin prepolymer, including:
[0050] (1) Preparation of epoxy silicone resin prepolymer: with reference to the steps of Example 1;
[0051] (2) Preparation of modified AHP: Weigh 1000g of AHP, add it into a small kneader, stir at high speed, heat up to 90°C, then weigh 54g of epoxy silicone resin prepolymer and 6g of 2-ethyl-4 methylimidazole , after heating to 90°C, use a watering can to spray on the high-speed stirring AHP, and heat up to 150°C-170°C and then cure for 3 hours to obtain microencapsulated modified AHP based on epoxy silicone resin prepolymer, marked as 6% ESi-AHP.
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