Vapor chamber based on flat loop heat pipe

Abstract

The present invention discloses a vapor chamber based on a flat plate loop heat pipe, so as to improve the heat transfer capability, the ultimate heat flux heat dissipation capability and the anti-overload and anti-gravity working capability of the vapor chamber, increase the size of a heat spreading plate, decrease the thickness of the vapor chamber, and solve a conflicting requirement of the improvement of the properties of the vapor chamber for a diameter size of a capillary wick. The flat plate loop heat pipe composed of an evaporator, a reservoir and a gas / liquid line is pre-buried in an aluminum alloy plate, so as to form the vapor chamber based on the flat plate loop heat pipe. The evaporator of the flat plate loop heat pipe is arranged in a region, attached to a biggest heat source of a chip to be subjected to heat dissipation, on the vapor chamber, and the side, provided with a vapor channel, of the evaporator is attached to the biggest heat source. "Heat sink attached regions" and "heat source attached regions" are arranged on the vapor chamber. The gas / liquid line led out from an outlet of the evaporator is cyclically disposed between the "heat sink attached regions" and the "heat source attached regions" on the vapor chamber. The gas / liquid line finally passes through the "heat sink attached regions" and then returns to the reservoir of the flat plate loop heat pipe.

Description

technical field [0001] The invention relates to a soaking plate, in particular to a soaking plate based on a flat loop heat pipe, which belongs to the technical field of heat dissipation of electronic equipment. Background technique [0002] The loop heat pipe is a high-efficiency two-phase heat transfer device, which has the characteristics of high heat transfer performance, long-distance heat transfer, excellent temperature control characteristics, arbitrary bending of the pipeline, and convenient installation. With comparable advantages, the loop heat pipe has very broad application prospects in many fields such as aviation, aerospace, and ground electronic equipment heat dissipation. [0003] Such as figure 1 As shown, the loop heat pipe mainly includes: an evaporator 1, a condenser 2, a liquid receiver 3, a vapor pipeline 4 and a liquid pipeline 5. Evaporation, absorbing the heat outside the evaporator 1, the generated steam flows from the steam pipeline 4 to the cond...

AI Technical Summary

Problems solved by technology

[0008] However, the application of vapor chambers has the following problems: there are contradictions in the requirements for product performance improvement on the capillary core. Heat transfer capacity, increase limit heat flux density, increase anti-overload and anti-gravity working ability, increase vapor chamber size; on the other hand, in order to improve some performance, the capillary core is required to obtain greater permeability by using a larger pore size, To increase the size of the vapor chamber, that is, to increase the flow length, it is necessary to reduce the flow resistance: to reduce the thickness of the vapor chamber, that is, to reduce the flow cross-sectional area, it is necessary to reduce the flow resistance

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