Aerogel heat insulating device for electronic product

Abstract

The invention relates to an aerogel heat insulating device for an electronic product. The aerogel heat insulating device for the electronic product comprises a graphene sheet layer and an aerogel sheet layer located above the graphene sheet layer, wherein a high-molecular polymer insulating protection layer or an adhesive layer is arranged on the upper surface of the aerogel sheet layer; an adhesive layer or a high-molecular polymer insulating protection layer is arranged on the lower surface of the graphene sheet layer and is different from the layer arranged on the upper surface of the aerogel sheet layer; the total thickness of the aerogel heat insulating device is 0.2 to 5mm. According to the aerogel heat insulating device for the electronic product, disclosed by the invention, high-layer thermal property of the graphene layer is combined with a low heat conductivity coefficient of the aerogel layer, so that local high temperature is reduced, and temperature difference between a heat source position and a position away from a heat source is reduced; the aerogel heat insulating device easily realizes die cutting and forming, can be self-bonded and bent, and has higher flexibility.

Description

technical field [0001] The invention relates to the field of heat insulation of heating components of electronic products, in particular to an airgel heat insulation device for electronic products. Background technique [0002] With the rapid development of microelectronics integration technology and high-density printed board assembly technology, the assembly density has increased rapidly, and the volume of electronic components and logic circuits has been reduced by tens of thousands of times. Notebook computers are increasingly becoming lighter, thinner, and smaller. At present, in order to match the running speed of the notebook computer CPU, the CPU usually needs to run at a high speed, so the local heat generation will increase greatly. With the increase of energy, the battery capacity also needs to be increased, and the heat generated by the internal impedance of the battery is greatly increased. If the heat energy cannot be dissipated and isolated in an orderly manne...

AI Technical Summary

Problems solved by technology

[0002] With the rapid development of microelectronics integration technology and high-density printed board assembly technology, the assembly density has increased rapidly, and the volume of electronic components and logic circuits has been reduced by tens of thousands of times. Notebook computers are increasingly becoming lighter, thinner, and smaller. At present, in order to match the running speed of the notebook computer CPU, the CPU usually needs to run at a high speed, so the local heat generation will increase greatly. With the increase of energy, the battery capacity also needs to be increased, and the heat generated by the internal impedance of the battery is greatly increased. If the heat energy cannot be dissipated and isolated in an orderly manner, the heat around the CPU, graphics card, LED light-emitting diodes, and batteries are heat-sensitive. Components have shortened life or lost function due to excessive temperature, especially if there is a large temperature difference between the location of the heat source and the location far away from the heat source

In particular, the temperature of the electronic product casing near the heat source is too high, which will cause discomfort to the user on the one hand, and on the other hand, the service life of the casing will be affected and the appearance of the casing will be deteriorated due to the high temperature of the casing

At present, the thermal insulation of electronic products on the market generally uses glass fiber, but the thermal conductivity of glass fiber is relatively high, and it is easy to shed chips. It needs to be wrapped and cannot be pressured, because the heat insulation function will be reduced after pressure is applied, and the processing technology is also relatively complicated.

Ordinary massive airgel is fragile, has no strength, cannot be molded, and cannot be directly used for heat insulation of electronic products

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