Application of 3,6-dioxa-1,8-octanediaminetetraacetic acid derivatives and osp treatment solution

A treatment liquid and dioxane technology, applied in the secondary treatment of printed circuits, coating non-metallic protective layer, printed circuit manufacturing, etc., can solve the problem of poor quality of gold surface, film on gold surface, scrap economy of PCB board, etc. question

Active Publication Date: 2019-06-28
GUANGDONG GUANGHUA SCI TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0011] Although the patent ZL00814440.0 of Enthone Company of the United States provides a solution for the selectivity between copper and gold, in the actual application process, the problem of the film on the gold surface still occurs from time to time, especially when the nickel-gold process is not strictly controlled, It is more likely to occur when the quality of the gold surface is poor, resulting in a large number of scrapped PCB boards and economic losses

Method used

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  • Application of 3,6-dioxa-1,8-octanediaminetetraacetic acid derivatives and osp treatment solution
  • Application of 3,6-dioxa-1,8-octanediaminetetraacetic acid derivatives and osp treatment solution
  • Application of 3,6-dioxa-1,8-octanediaminetetraacetic acid derivatives and osp treatment solution

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Embodiment Construction

[0048] In order to facilitate the understanding of the present invention, the present invention will be described more fully below. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0049] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field of the present invention. The terms used in the description of the present invention herein are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. The term "and / or" as used herein includes any and all combinations of one or more related listed items.

[0050] The component compositions of Examples 1-10 and Comparative Examples 1-3 are show...

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Abstract

The invention relates to an application of a compound with a structure as shown in the formula I in an OSP processing liquid of a printed circuit board. The OSP processing liquid adopts the compound with the structure as shown in the formula I, so that the film thickness on a gold surface can be remarkably reduced, and copper gold selectivity of the OSP is improved; and meanwhile, the high temperature resistance and tinning rate of the OSP film of a PCB test board can be improved, the weldability of the PCB is improved, and the processing capacity of the OSP technology is effectively improved.

Description

Technical field [0001] The invention relates to the technical field of printed circuit board chemicals, in particular to the application of 3,6-dioxa-1,8-octanediaminetetraacetic acid derivatives and an OSP treatment liquid. Background technique [0002] The Organic Solderable Protective Process (OSP) has been used in the industry for many years. Its main function is to conduct corrosion and oxidation resistance on the copper surface of the PCB (Printed Circuit Board), so that the copper surface It is not easy to be oxidized during storage and under high-temperature use conditions, maintaining excellent solderability of the pad. Foreign Japanese patents 5-186888, 7-24305, US patents 5376189, 5173130, European patent EP0791671, and our company's patents CN200910042221.4 and CN201110043355.5 have described the protection technology in detail. Their film-forming substances include benzotriazole, benzimidazole and aryl phenyl imidazole, etc. The advantages are water-soluble products...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/28C23F11/14
CPCC23F11/147H05K3/282
Inventor 肖定军黎小芳叶绍明赵明宇王翀
Owner GUANGDONG GUANGHUA SCI TECH
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