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Special engineering plastic alloy material for notebook computer

An engineering plastic alloy and notebook computer technology, which is applied in applications, chemicals for biological control, biocides, etc., can solve problems that affect the appearance and performance of notebooks, damage human health, and easily breed bacteria, etc., to achieve enhanced use Years, dust reduction, long-lasting effects

Inactive Publication Date: 2017-09-15
HEFEI DONGHENGRUI ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In addition, due to long-term use of notebooks, it is easy to accumulate dust on the surface of the casing, which affects the appearance and performance of the notebook, and with the increase of dust, it is easier to breed harmful substances such as bacteria, which will damage human health. A special engineering plastic alloy material for notebook with dust removal function

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] A special engineering plastic alloy material for notebook computer provided in this embodiment, the special engineering plastic alloy material for notebook computer comprises the following raw materials in parts by weight: 70 parts of PC resin, 19 parts of ABS resin, 9 parts of adsorbent, flame retardant 1.1 parts, 3 parts of pigment, 20 parts of plasticizer, 6 parts of antifungal agent.

[0027] Wherein, the PC resin includes the following components in parts by weight: 1.4 parts of anhydrite powder, 0.1 part of silicone resin powder, and the balance is PC resin.

[0028] Wherein, described PC resin preparation method is as follows:

[0029] (1) Dry the PC resin at 88°C for 2 hours;

[0030] (2) Weigh anhydrous gypsum powder, silicone resin powder, and PC resin in a high-speed mixer for 7 minutes at a speed of 3000r / min, and put them in an extruder for extrusion;

[0031] (3) The material obtained by extrusion in step (2) is cooled and then cut into pellets.

[0032...

Embodiment 2

[0041] This embodiment provides a special engineering plastic alloy material for notebook computers, which includes the following raw materials in parts by weight: 60 parts of PC resin, 26 parts of ABS resin, 2 parts of adsorbent, and flame retardant 1.8 parts, 1 part of pigment, 30 parts of plasticizer, 5 parts of antifungal agent.

[0042] Wherein, the PC resin includes the following ingredients in parts by weight: 0.1 part of anhydrite powder, 1.1 part of silicone resin powder, and the balance is PC resin.

[0043] Wherein, described PC resin preparation method is as follows:

[0044] (1) Dry the PC resin at 81°C for 4 hours;

[0045] (2) Weigh anhydrous gypsum powder, silicone resin powder, and PC resin in a high-speed mixer for 3 minutes at a speed of 7000r / min, and put them in an extruder for extrusion;

[0046] (3) The material obtained by extrusion in step (2) is cooled and then cut into pellets.

[0047] Wherein, the antifungal agent is made of Chinese herbal medic...

Embodiment 3

[0056] This embodiment provides a special engineering plastic alloy material for notebook computers, which includes the following raw materials in parts by weight: 65 parts of PC resin, 21 parts of ABS resin, 5 parts of adsorbent, and flame retardant 1.5 parts, 2 parts of pigment, 25 parts of plasticizer, 5 parts of antifungal agent.

[0057] Wherein, the PC resin includes the following components in parts by weight: 1.2 parts of anhydrite powder, 0.9 parts of silicone resin powder, and the balance is PC resin.

[0058] Wherein, described PC resin preparation method is as follows:

[0059] (1) Dry the PC resin at 83°C for 3 hours;

[0060] (2) Weigh anhydrous gypsum powder, silicone resin powder, and PC resin in a high-speed mixer for 4 minutes at a speed of 3500r / min, and put them in an extruder for extrusion;

[0061] (3) The material obtained by extrusion in step (2) is cooled and then cut into pellets.

[0062] Wherein, the antifungal agent is made of Chinese herbal med...

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PUM

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Abstract

The invention belongs to the technical field of a computer material, and provides a special engineering plastic alloy material for a notebook computer. The special engineering plastic alloy material is prepared from, by weight, 60-70 parts of PC resin, 19-26 parts of ABS resin, 2-9 parts of absorbent, 1.1-1.8 parts of flame retardant, 1-3 parts of pigment, 20-30 parts of plasticizer, and 5-6 parts of mildew preventive. The special engineering plastic alloy material takes engineering plastic alloy as a main material, and absorbent, flame retardant, antioxidant and others as the assistant components, and is prepared to be a composite material with self-cleaning dust removal, fire prevention, mildew prevention, and other functions.

Description

technical field [0001] The invention belongs to the technical field of computer materials, and in particular relates to a special engineering plastic alloy material for notebook computers. Background technique [0002] Polycarbonate / acrylonitrile-butadiene-styrene copolymer plastic alloy material is a high-performance thermoplastic engineering plastic with good comprehensive properties that has been developed rapidly in the past forty years. It combines polycarbonate (PC) Integrate the excellent properties of two materials, such as acrylonitrile-butadiene-styrene copolymer (ABS), such as excellent impact resistance, heat resistance and rigidity, and also have high gloss and excellent processing fluidity And dimensional stability, so it is widely used in communication electronic instruments, office equipment, household appliances and auto parts and other fields. [0003] However, since the polycarbonate / acrylonitrile-butadiene-styrene copolymer plastic alloy material is a ki...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L69/00C08L55/02C08L83/04C08K13/06C08K3/22C08K9/06C08K9/08C08K9/04C08K3/34C08K3/32C08K5/3492C08K5/00A01N65/46A01P1/00
CPCC08L69/00A01N65/00A01N65/46C08K2003/2206C08K2003/2224C08K2003/323C08L2201/02C08L55/02C08L83/04C08K13/06C08K3/22C08K9/06C08K9/08C08K9/04C08K3/346C08K3/32C08K5/3492C08K5/0058A01N2300/00
Inventor 齐慧
Owner HEFEI DONGHENGRUI ELECTRONICS TECH CO LTD
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