Preparation method for low-temperature sintered tin-doped nano-silver soldering paste

A low-temperature sintering and nano-silver technology, applied in welding equipment, welding media, manufacturing tools, etc., can solve problems such as damage to electronic devices, increase operating costs, and unbearable sintering temperature, and achieve strict process procedures, increased connection strength, and implementation rigorous effect

Inactive Publication Date: 2017-09-19
TIANJIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, compared with ordinary alloy solders, the sintering temperature of nano-silver solder paste (280°C) is too high to be suitable for industrial applications, and many electronic materials such as printed circuit boards on the market cannot withstand too high a temperature during the packaging process. Sintering temperature, so it is very urgent to reduce the sintering temperature of nano-silver solder paste
[0003] At present, there are two main methods to reduce the sintering temperature of nano-silver. One is to apply a certain pressure during the sintering process of nano-silver solder paste. However, this method is likely to cause damage to electronic devices and increase the complexity of the process. ;Another way is to reduce the particle size of the silver nanoparticles, but this method will increase the operating cost
As far as nano-silver solder paste with a particle size of 100nm is concerned, it cannot form a dense body when sintered at low temperature (no pressure is applied during the sintering process), so the strength is not very high
According to the theory of fine-grain strengthening, adding fine SiC particles to provide nucleation cores for nano-silver particles during the sintering process can improve the matrix strength, but the bonding performance of SiC and nano-silver is not very good. Moreover, the conductivity of SiC is not good, and it is easy to provide a source of failure during the use of the device.

Method used

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  • Preparation method for low-temperature sintered tin-doped nano-silver soldering paste
  • Preparation method for low-temperature sintered tin-doped nano-silver soldering paste
  • Preparation method for low-temperature sintered tin-doped nano-silver soldering paste

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] (1) Configuration of solder paste: the raw materials are powder of Sn element (particle size is 10 μm) and rosin flux (specifications are shown in Table 1). Calculate the ratio according to the mass fraction (the mass ratio of tin powder and flux is 9:1), weigh various raw materials with an electronic analytical balance, and stir them for 2 hours with a mechanical mixer to make them evenly mixed, and the mixer speed is 2000rpm / min; complete Solder paste configuration.

[0026] Table 1 Experimental drugs

[0027]

[0028] (2) Configuration of TDSP: Weigh the nano-silver solder paste and micron-scale solder paste in the test tube according to the mass ratio, so that the mass fraction ratio of silver and tin is 96:4 respectively. Add terpineol to fully dissolve, and use a spiral oscillator for mechanical oscillation (oscillation time: 30min) and an ultrasonic cleaner for ultrasonic oscillation (oscillation time: 60min, oscillation power: 100W).

[0029] (3) Forming of...

Embodiment 2

[0032] (1) Configuration of solder paste: the raw materials are powder of Sn element (particle size is 10 μm) and rosin flux (specifications are shown in Table 1). Calculate the ratio according to the mass fraction (the mass ratio of tin powder and flux is 9:1), weigh various raw materials with an electronic analytical balance, and stir them with a mechanical mixer for 1 hour to make them evenly mixed, and the mixer speed is 1000rpm / min; complete Solder paste configuration.

[0033] Table 1 Experimental drugs

[0034]

[0035] (2) Configuration of TDSP: Weigh the nano-silver solder paste and micron-scale solder paste in the test tube according to the mass ratio, so that the mass fraction ratio of silver and tin is 99:1 respectively. Add terpineol to fully dissolve, and use a spiral oscillator for mechanical oscillation (oscillation time of 25 minutes) and an ultrasonic cleaner for ultrasonic oscillation (oscillation time of 55 minutes, oscillation power of 200W).

[0036]...

Embodiment 3

[0039] (1) Configuration of solder paste: the raw materials are powder of Sn element (particle size is 10 μm) and rosin flux (specifications are shown in Table 1). Calculate the ratio according to the mass fraction (the mass ratio of tin powder and flux is 9:1), weigh various raw materials with an electronic analytical balance, and stir them for 1.5 hours with a mechanical mixer to make them evenly mixed, and the mixer speed is 1500rpm / min; complete Solder paste configuration.

[0040] Table 1 Experimental drugs

[0041]

[0042](2) Configuration of TDSP: Weigh the nano silver solder paste and micron solder paste in the test tube according to the mass ratio, so that the mass fraction ratio of silver and tin is 90:10. Add terpineol to fully dissolve, and use a spiral oscillator to perform mechanical oscillation (oscillation time: 35 minutes) and an ultrasonic cleaner to perform ultrasonic oscillation (oscillation time: 65 minutes, oscillation power: 150W).

[0043] (3) For...

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Abstract

The invention relates to a preparation method for low-temperature sintered tin-doped nano-silver soldering paste. According to the mass ratio of tin powder to a soldering flux, 90% of powder and 10% of the rosin soldering flux are prepared, wherein raw material of the powder is Sn element. A micron solder paste is prepared through stirring, the silver mass fraction is 90-99%, and the tin mass fraction is 1-10%; a nano-silver soldering paste and the micron solder paste are weighed and added with terpilenol to be dissolved, firstly mechanical oscillation is conducted by using a spiral oscillator, then ultrasonic oscillation is conducted by using an ultrasonic cleaner, and a mixture is obtained; and constant temperature bath and volatilization are conducted on the mixture at the temperature of 70 DEG C till the mixture is in a paste shape. Pressure is not added in the sintering process of the tin-doped nano-silver soldering paste, protection of inert gases is not needed, and the maximum sintering temperature is 235 DEG C. According to the preparation method for the low-temperature sintered tin-doped nano-silver soldering paste, the process procedure is well-conceived, and implementation is strict; and the sintering temperature of the low-temperature sintered tin-doped nano-silver soldering paste is lower than the sintering temperature of a traditional silver soldering paste, and compared with a pure nano-silver soldering paste, under the same sintering process, the connection strength of the low-temperature sintered tin-doped nano-silver soldering paste after being sintered is double of the connection strength of the pure nano-silver soldering paste.

Description

technical field [0001] The invention relates to the field of electronic package preparation, in particular to a preparation method of low-temperature sintered tin-doped nano-silver solder paste. Background technique [0002] Nano-silver solder paste has become a high-power device chip because it can be sintered at low temperature and is a single-material silver layer porous material after sintering. It has excellent thermal, electrical, mechanical properties and reliability, and can be used in high-temperature environments. level connection material. However, compared with ordinary alloy solder, the sintering temperature of nano-silver solder paste (280°C) is too high to be suitable for industrial applications, and many electronic materials such as printed circuit boards on the market cannot withstand too high temperature during the packaging process. Sintering temperature, so it is very urgent to reduce the sintering temperature of nano-silver solder paste. [0003] At pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/40B23K35/30
CPCB23K35/40B23K35/3006
Inventor 李欣杨呈祥陆国权梅云辉
Owner TIANJIN UNIV
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