Preparation method for low-temperature sintered tin-doped nano-silver soldering paste
A low-temperature sintering and nano-silver technology, applied in welding equipment, welding media, manufacturing tools, etc., can solve problems such as damage to electronic devices, increase operating costs, and unbearable sintering temperature, and achieve strict process procedures, increased connection strength, and implementation rigorous effect
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Embodiment 1
[0025] (1) Configuration of solder paste: the raw materials are powder of Sn element (particle size is 10 μm) and rosin flux (specifications are shown in Table 1). Calculate the ratio according to the mass fraction (the mass ratio of tin powder and flux is 9:1), weigh various raw materials with an electronic analytical balance, and stir them for 2 hours with a mechanical mixer to make them evenly mixed, and the mixer speed is 2000rpm / min; complete Solder paste configuration.
[0026] Table 1 Experimental drugs
[0027]
[0028] (2) Configuration of TDSP: Weigh the nano-silver solder paste and micron-scale solder paste in the test tube according to the mass ratio, so that the mass fraction ratio of silver and tin is 96:4 respectively. Add terpineol to fully dissolve, and use a spiral oscillator for mechanical oscillation (oscillation time: 30min) and an ultrasonic cleaner for ultrasonic oscillation (oscillation time: 60min, oscillation power: 100W).
[0029] (3) Forming of...
Embodiment 2
[0032] (1) Configuration of solder paste: the raw materials are powder of Sn element (particle size is 10 μm) and rosin flux (specifications are shown in Table 1). Calculate the ratio according to the mass fraction (the mass ratio of tin powder and flux is 9:1), weigh various raw materials with an electronic analytical balance, and stir them with a mechanical mixer for 1 hour to make them evenly mixed, and the mixer speed is 1000rpm / min; complete Solder paste configuration.
[0033] Table 1 Experimental drugs
[0034]
[0035] (2) Configuration of TDSP: Weigh the nano-silver solder paste and micron-scale solder paste in the test tube according to the mass ratio, so that the mass fraction ratio of silver and tin is 99:1 respectively. Add terpineol to fully dissolve, and use a spiral oscillator for mechanical oscillation (oscillation time of 25 minutes) and an ultrasonic cleaner for ultrasonic oscillation (oscillation time of 55 minutes, oscillation power of 200W).
[0036]...
Embodiment 3
[0039] (1) Configuration of solder paste: the raw materials are powder of Sn element (particle size is 10 μm) and rosin flux (specifications are shown in Table 1). Calculate the ratio according to the mass fraction (the mass ratio of tin powder and flux is 9:1), weigh various raw materials with an electronic analytical balance, and stir them for 1.5 hours with a mechanical mixer to make them evenly mixed, and the mixer speed is 1500rpm / min; complete Solder paste configuration.
[0040] Table 1 Experimental drugs
[0041]
[0042](2) Configuration of TDSP: Weigh the nano silver solder paste and micron solder paste in the test tube according to the mass ratio, so that the mass fraction ratio of silver and tin is 90:10. Add terpineol to fully dissolve, and use a spiral oscillator to perform mechanical oscillation (oscillation time: 35 minutes) and an ultrasonic cleaner to perform ultrasonic oscillation (oscillation time: 65 minutes, oscillation power: 150W).
[0043] (3) For...
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