A kind of film tearing method for preparing conductive grid wire of hit solar cell

Abstract

The invention discloses a film tearing method for the preparation of an HIT solar cell conductive grid line, and the method comprises the following steps: pasting light-sensing films on the upper and lower surfaces of a silicon chip, wherein the light-sensing films are provided with protection films, parts, making contact with the silicon chip, of the light-sensing films are exposure regions which are provided with buffering regions in an outwards extending manner, and the other regions are non-buffering regions; carrying out the exposing of the exposure regions and the non-buffering regions of the light-sensing films of the regions corresponding to the size of the silicon chip; cutting the region outside the buffering regions; and tearing the protection films on the surfaces of the light-sensing films. According to the invention, the toughness of the light-sensing films is weakened, and the adhesive power between the exposed light-sensing films and the protection films is also weakened, thereby facilitating the tearing of the films. The protection films are very easy to tear. The light-sensing films in non-exposed regions of the buffering regions are good in toughness, and are not easy to tear, thereby enabling the cut places of the exposed light-sensing films to be easier to tear. Moreover, no crack is caused by the zigzag shape of a notch and extends to the surface of the silicon chip, and no impact on an exposure graphic is generated.

Description

technical field [0001] The invention relates to the field of solar cells, in particular to a film tearing method for preparing conductive grid lines of HIT solar cells. Background technique [0002] HIT solar cell is a hybrid solar cell made of crystalline silicon substrate and amorphous silicon thin film. Compared with traditional single / polycrystalline silicon cells, it has higher power generation efficiency, better stability and lower cost. [0003] The high-conductivity grid line preparation process of HIT solar cells includes: film attachment, exposure and development, and metal grid formation. When the film is attached, there is a protective film on the surface of the photosensitive film of the silicon wafer, which needs to be torn off after exposure and before development. like figure 1 As shown, the traditional silicon wafer film attachment method is to attach a photosensitive film 203 with a layer of protective film 202 on the upper surface and lower surface of the...

AI Technical Summary

Problems solved by technology

[0006] In view of the above problems, the present invention provides a film tearing method for preparing the conductive grid lines of HIT solar cells, which solves the problem that the unexposed photosensitive film is cut into a jagged shape. Cracks are generated and extended to the surface of the silicon wafer, thereby affecting the exposure pattern of the silicon wafer surface, affecting the production yield and preparation quality of solar cells

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