High-precision LCD grinding and cutting equipment and its grinding and cutting method

Abstract

The invention relates to the technical field of LCD abrasion cutting devices, and discloses a high-precision LCD abrasion cutting device and an abrasion cutting method thereof. The high-precision LCD abrasion cutting device comprises a rack, a horizontal transferring system arranged on the rack and used for horizontally transversely and / or horizontally longitudinally transferring an LCD to be subject to abrasion cutting, a bearing system arranged on the horizontal transferring system and used for bearing and fixing the LCD to be subject to abrasion cutting, an abrasion disc assembly which is arranged on the rack and located on one side of the horizontal transferring system to be used for carrying out abrasion cutting on the LCD to be subject to abrasion cutting and a control system arranged on one side of the rack and electrically connected with the horizontal transferring system and the abrasion disc assembly. According to the high-precision LCD abrasion cutting device and the abrasion cutting method thereof, the high-precision LCD abrasion cutting device meets the high-precision machining precision and achieves simultaneous abrasion cutting machining of the multiple LCDs to be subject to abrasion cutting, production efficiency is improved, the roughness of the abrasion cutting end faces is improved, meanwhile, the raw material use rate is improved, and production cost is reduced.

Description

technical field [0001] The invention relates to the technical field of LCD grinding and cutting equipment, in particular to a high-precision LCD grinding and cutting equipment and a grinding and cutting method thereof. Background technique [0002] With the rapid development of science and technology, Liquid Crystal Display (LCD for short) is widely used in various aspects of production and life. , various LCDs that require grinding and cutting have been proposed accordingly. For these LCDs that need to be ground and cut, the existing grinding and cutting LCD processing method is to use diamond tools to grind by hand or use an LCD engraving machine to carve. [0003] The manual grinding and cutting method is as follows: manually grab the LCD single product, put the part to be processed on the rotating diamond grinding disc to grind, and check the grinding amount visually. The process capability of this method can only be ±0.20mm, and the processing accuracy is low. And the...

AI Technical Summary

Problems solved by technology

[0003] The manual grinding and cutting method is as follows: manually grab the LCD single product, put the part to be processed on the rotating diamond grinding disc to grind, and check the grinding amount visually. The process capability of this method can only be ±0.20mm, and the processing accuracy is low. And the consistency is poor, that is to say, the advantage of this method is that the production process is simple and the investment in equipment is small, and the disadvantages are that the grinding and cutting precision is not easy to control, the labor intensity of workers is high, and the production efficiency is low.

In addition, the special-shaped engraving method of the LCD engraving machine is as follows: after the image controller (Charge-coupled Device, CCD) of the LCD engraving machine captures the target on the LCD motherboard to complete the precise positioning, the industrial control system issues an instruction to make the diamond tool Slide and feed on the LCD motherboard to complete the engraving of the LCD single products one by one. After the engraving is completed, the LCD and the waste are separated manually. Engraving a single product on the motherboard has low production efficiency, produces a lot of edge material, and wastes materials. That is to say, the advantage of this method is high processing precision, but the disadvantage is that the utilization rate of raw materials is low, which increases production costs.

Images