Passivation emitter solar cell back silver paste
A technology for solar cells and passivated emitters, applied to conductive materials, circuits, electrical components, etc. dispersed in non-conductive inorganic materials, can solve p-n junction damage, poor adhesion between back silver and back passivation film, Problems such as poor contact performance, to achieve the effect of reducing reaction, excellent contact performance, and reducing surface recombination loss
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Embodiment 1
[0027] In embodiment 1, inorganic binder is PbO-ZnO-Bi 2 o 3 -B 2 o 3 -SiO 2 -Sb 2 o 3 System glass powder; wherein the organic solvent in the organic carrier is ethylene glycol butyl ether acetate, and the weight percentage of the organic solvent in the organic carrier is 80%, and the surfactant and rheological agent are not included in Example 1. The composition of glass frit A of embodiment 1 is 35% PbO, 10% Bi 2 o 3 , 5% B 2 o 3 , 40% SiO 2 , 5% Al 2 o 3 , 2% ZnO and 3% CaO; the composition of glass frit B is 30% PbO, 30% TeO 2 , 10% MnO 2 , 5% CuO and 15% ZrO 2 , the weight ratio of glass powder A to glass powder B is 10:1. The specific surface area of silver powder is 1~2m 2 / g; tap density 2.5~3.5g / cm 3 . The silver powder is selected from a conventional particle size of 0.2-1.7 μm; the thickener is alkyd resin.
Embodiment 2
[0028] The difference between Example 2 and Example 1 lies in the weight percentage of the components of the silver paste, as shown in the above table.
[0029] The difference between embodiment 3-9 and embodiment 2 is the composition of glass powder A and glass powder B:
Embodiment 3
[0030] The composition of embodiment 3 glass powder A is: PbO20%, Bi 2 o 3 50%, B 2 o 3 5%, SiO 2 14%, Al 2 o 3 3%, ZnO6%, CaO2%; the composition of glass frit B is: PbO13%, TeO 2 20%, MnO 2 50%, CuO10%, ZrO 2 7%;
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