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NTC thermistor and NTC thermistor chip processing method

A thermistor and processing method technology, applied in the direction of resistors, resistor parts, resistors with negative temperature coefficients, etc., can solve the problems that the chip cannot be prepared, takes a long time, and the chip is not easy to configure, etc., to achieve Good ohmic contact, strong adhesion, and simple processing methods

Inactive Publication Date: 2017-10-20
安徽晶格尔电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The resistance and B value chips commonly used in the market are fixed in actual products, but there are often some special products in the market. The resistance and B value chips required by these special products are not easy to configure. It takes a lot of time to conduct data experiments, and it is impossible to prepare chips with some resistance values ​​and B values.

Method used

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  • NTC thermistor and NTC thermistor chip processing method

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Embodiment Construction

[0018] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0019] Such as figure 1 As shown, a kind of NTC thermistor provided by the present invention is characterized in that: it includes a chip, and the chip includes a first substrate 1 and a second substrate 2 correspondingly arranged, and between the first substrate 1 and the second substrate 2 The first substrate 1 and the second substrate 2 are all provided with lead wires 5, and each of the lead wires 5 is soldered to the corresponding first substrate 1 or second substrate 2 through silver paste. On the second substrate 2, the lead wire 5 includes a wire, the wire is an alloy of copper, iron and n...

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Abstract

The invention discloses an NTC thermistor and an NTC thermistor chip processing method. The NTC thermistor comprises a chip, the chip comprises a first substrate (1) and a second substrate (2), the first substrate (1) and the second substrate (2) are bonded through conductive glue (3), the first substrate (1) and the second substrate (2) are provided with leads (5), an encapsulation layer (4) is arranged outside the chip, one end of each one of the leads (5) is disposed in the encapsulation layer (4), and the other end is disposed outside the encapsulation layer (4). The NTC thermistor is applicable to various types of NTC substrates, has strong adhesion, good ohmic contact and double-layer stability after sintering and reduces yellowing and blackening caused by oxidation. The NTC thermistors having specific resistance values and B values are prepared from chips having different resistance values and B values, can be processed through simple processes and are suitable for mass production. The method can fast process a chip having a desired resistance value and B value.

Description

technical field [0001] The invention relates to the technical field of thermistors, in particular to an NTC thermistor and a chip processing method for the NTC thermistor. Background technique [0002] NTC thermistors are mainly made of metal oxides such as manganese, cobalt, nickel and copper, and are manufactured by ceramic technology. They are widely used in temperature measurement, temperature compensation and other occasions. NTC thermistors used in different products will have different resistance and B value requirements. The resistance and B value chips commonly used in the market are fixed in actual products, but there are often some special products in the market. The resistance and B value chips required by these special products are not easy to configure. It takes a lot of time to conduct data experiments, and it is impossible to prepare chips with some resistance values ​​and B values. Contents of the invention [0003] The object of the present invention is...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01C7/04H01C1/02H01C1/144
CPCH01C7/04H01C1/02H01C1/144
Inventor 阴卫华周好王建江孙振石宇
Owner 安徽晶格尔电子有限公司