Method of fabricating circuit on ductile flexible substrate

A flexible substrate and circuit technology, applied in chemical/electrolytic methods to remove conductive materials, photolithography/patterning, patterning and photolithography, etc., can solve the problem of increasing the circuit manufacturing process and production costs, and reducing the overall extensibility of the circuit , complex polyimide patterning process, etc., to overcome cracks and open circuits, avoid mismatching problems, and reduce equipment dependence

Active Publication Date: 2017-10-20
SHANDONG UNIV OF SCI & TECH
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Problems solved by technology

[0005] The main disadvantages of the above technical solutions are: (1) a polyimide transition layer is introduced between the surface of the flexible stretchable material and the metal. On the one hand, the patterning process of polyimide is complicated, which increases the process flow and Cost of production
On the other hand, the polyimide layer with

Method used

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  • Method of fabricating circuit on ductile flexible substrate
  • Method of fabricating circuit on ductile flexible substrate
  • Method of fabricating circuit on ductile flexible substrate

Examples

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[0035] Example 1

[0036] Combine Figure 1 to Figure 8 The present invention can be applied to the manufacture of flexible electronic devices with various structures, and there is no requirement on the material, structure, and shape of the circuit. This example is based on the production on polydimethylsiloxane membrane (PDMS) figure 1 The circuit diagram shown is an example to illustrate the implementation method of the present invention. 101 is a circuit interconnection line, 102 is a circuit function module, and 103 is a malleable and flexible substrate of polydimethylsiloxane. In order to adapt to the stretching of the extensible flexible substrate 103, the circuit interconnection line 101 has a curved connection shape with a width of 0.5 mm.

[0037] Step 1: Such as figure 2 As shown, a clean dust-free glass plate is selected as the hard thin plate 104, a small amount of ordinary double-sided tape is pasted on the surface of the glass plate, and the rolled thin copper foil...

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Abstract

The invention provides a method for fabricating a circuit on a ductile flexible substrate. The method includes the steps of flattening a thin copper foil and then fixing the thin copper foil on a hard thin plate to clean an upper surface, which is not in contact with the hard thin plate, of the thin copper foil; fixing a flexible substrate on the cleaned surface of the thin copper foil; peeling off and overturning the flexible substrate and the thin copper foil as a whole from the hard thin plate, fixing the side having the flexible substrate on the hard thin plate, and cleaning the side, which is not in contact with the flexible substrate, of the thin copper foil; fabricating a resist film pattern of the desired circuit on the surface of the thin copper foil; placing the thin copper foil layer with the resist film pattern in a copper etching solution to remove the redundant thin copper foil layer; removing the residual resist film by using a release agent, and washing with water and acetone; and peeling off the thin copper foil and the flexible substrate from the hard thin plate to complete the fabricating process. The method of the invention effectively avoids the problem of mismatch between the metal and the flexible substrate, overcomes the problem of metal wire crack and circuit breakage, and has the characteristics of strong process reliability and low material and process costs.

Description

technical field [0001] The invention belongs to the technical field of flexible electronic device manufacturing, and in particular relates to a method for manufacturing a circuit on an extensible flexible substrate. Background technique [0002] Wearable electronic devices are one of the fastest growing fields in the information industry. One of the key problems restricting the performance and volume of wearable electronic devices is that the rigid substrate printed circuit board (PCB) used cannot meet the requirements for the use of such devices in non-planar environments such as clothing, skin, and organs. A technology for fabricating various functional electronic devices on bendable and extensible flexible substrates. Existing manufacturing of circuit patterns on flexible substrates mainly adopts printed circuit board (FPC) technology based on polyimide (PI) substrate. However, polyimide materials have low elastic properties and poor ductility, and can only be bent but ...

Claims

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Application Information

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IPC IPC(8): H05K3/06
CPCH05K3/06H05K2203/0502
Inventor 陈达马纪龙王璟璟刘维慧张震
Owner SHANDONG UNIV OF SCI & TECH
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