Method of fabricating circuit on ductile flexible substrate

The invention provides a method for fabricating a circuit on a ductile flexible substrate. The method includes the steps of flattening a thin copper foil and then fixing the thin copper foil on a hard thin plate to clean an upper surface, which is not in contact with the hard thin plate, of the thin copper foil; fixing a flexible substrate on the cleaned surface of the thin copper foil; peeling off and overturning the flexible substrate and the thin copper foil as a whole from the hard thin plate, fixing the side having the flexible substrate on the hard thin plate, and cleaning the side, which is not in contact with the flexible substrate, of the thin copper foil; fabricating a resist film pattern of the desired circuit on the surface of the thin copper foil; placing the thin copper foil layer with the resist film pattern in a copper etching solution to remove the redundant thin copper foil layer; removing the residual resist film by using a release agent, and washing with water and acetone; and peeling off the thin copper foil and the flexible substrate from the hard thin plate to complete the fabricating process. The method of the invention effectively avoids the problem of mismatch between the metal and the flexible substrate, overcomes the problem of metal wire crack and circuit breakage, and has the characteristics of strong process reliability and low material and process costs.