Method of fabricating circuit on ductile flexible substrate

A flexible substrate and circuit technology, applied in chemical/electrolytic methods to remove conductive materials, photolithography/patterning, patterning and photolithography, etc., can solve the problem of increasing the circuit manufacturing process and production costs, and reducing the overall extensibility of the circuit , complex polyimide patterning process, etc., to overcome cracks and open circuits, avoid mismatching problems, and reduce equipment dependence

Active Publication Date: 2017-10-20
SHANDONG UNIV OF SCI & TECH
4 Cites 5 Cited by

AI-Extracted Technical Summary

Problems solved by technology

[0005] The main disadvantages of the above technical solutions are: (1) a polyimide transition layer is introduced between the surface of the flexible stretchable material and the metal. On the one hand, the patterning process of polyimide is complicated, which increases the process flow and Cost of production
On the other hand, the polyimide layer with...
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Abstract

The invention provides a method for fabricating a circuit on a ductile flexible substrate. The method includes the steps of flattening a thin copper foil and then fixing the thin copper foil on a hard thin plate to clean an upper surface, which is not in contact with the hard thin plate, of the thin copper foil; fixing a flexible substrate on the cleaned surface of the thin copper foil; peeling off and overturning the flexible substrate and the thin copper foil as a whole from the hard thin plate, fixing the side having the flexible substrate on the hard thin plate, and cleaning the side, which is not in contact with the flexible substrate, of the thin copper foil; fabricating a resist film pattern of the desired circuit on the surface of the thin copper foil; placing the thin copper foil layer with the resist film pattern in a copper etching solution to remove the redundant thin copper foil layer; removing the residual resist film by using a release agent, and washing with water and acetone; and peeling off the thin copper foil and the flexible substrate from the hard thin plate to complete the fabricating process. The method of the invention effectively avoids the problem of mismatch between the metal and the flexible substrate, overcomes the problem of metal wire crack and circuit breakage, and has the characteristics of strong process reliability and low material and process costs.

Application Domain

Lithography/patterningConductive material chemical/electrolytical removal

Technology Topic

Copper foilResist +3

Image

  • Method of fabricating circuit on ductile flexible substrate
  • Method of fabricating circuit on ductile flexible substrate
  • Method of fabricating circuit on ductile flexible substrate

Examples

  • Experimental program(1)

Example Embodiment

[0035] Example 1
[0036] Combine Figure 1 to Figure 8 The present invention can be applied to the manufacture of flexible electronic devices with various structures, and there is no requirement on the material, structure, and shape of the circuit. This example is based on the production on polydimethylsiloxane membrane (PDMS) figure 1 The circuit diagram shown is an example to illustrate the implementation method of the present invention. 101 is a circuit interconnection line, 102 is a circuit function module, and 103 is a malleable and flexible substrate of polydimethylsiloxane. In order to adapt to the stretching of the extensible flexible substrate 103, the circuit interconnection line 101 has a curved connection shape with a width of 0.5 mm.
[0037] Step 1: Such as figure 2 As shown, a clean dust-free glass plate is selected as the hard thin plate 104, a small amount of ordinary double-sided tape is pasted on the surface of the glass plate, and the rolled thin copper foil 105 (0.8 mm thick) is flattened, and the copper foil is closely attached to the On the surface, take care to exclude air bubbles. Use acetone and copper chemical polishing agent to clean the surface of the thin copper foil 105 that does not touch the glass plate to remove surface grease and oxide layer.
[0038] Step 2: Such as image 3 As shown, the prepared polydimethylsiloxane film adhesive is spin-coated on the surface of the cleaned thin copper foil 105. According to the required substrate thickness, the spin-coating speed can be adjusted to 2000-5000 revolutions per minute. The time is 30 seconds. In this embodiment, the thickness of the flexible substrate 103 is 0.1 mm, and the spin coating speed is 2500 revolutions per minute. After the spin coating is completed, it is cured in an environment of 80 degrees Celsius for 30 minutes.
[0039] Step 3: Such as Figure 4 As shown, the entire flexible substrate and thin copper foil are peeled from the glass plate. Different peeling methods are used according to the thickness of the substrate. In this embodiment, since the overall thickness of the flexible substrate and the thin copper foil is small, the double-sided adhesive is dissolved by using an organic solvent such as acetone and then peeled off with the help of a roller. For thicker substrates, it can be peeled off directly.
[0040] After the peeling is completed, the side with the flexible base film is attached to the hard thin plate 104. In this embodiment, since polydimethylsiloxane and glass have good self-adsorption properties, no special treatment for glue application is required. If you use other flexible materials and hard thin plates, you can use easy-to-remove glue to paste according to the situation.
[0041] Use acetone and copper chemical polishing agent to clean the side of the thin copper foil that does not touch the flexible substrate to remove surface grease and oxide layer.
[0042] Step 4: Such as Figure 5 As shown, the resist film pattern 106 of the desired circuit is fabricated on the surface of the thin copper foil. The screen printing, photosensitive and heat-sensitive resist film processes in general PCB manufacturing can be used. In this embodiment, a simple screen printing method is used to fabricate the blue oil pattern of the resist film on the surface of the thin copper foil.
[0043] Step 5: Such as Image 6 As shown, the copper foil layer with the resist film pattern 106 is placed in a copper etching solution to remove the excess thin copper foil layer. The copper etching solution that can be used does not corrode the flexible substrate, the hard sheet and the resist film, including ferric chloride solution, hydrogen peroxide plus hydrochloric acid solution, sodium persulfate solution, etc. Sodium persulfate solution is used in this embodiment. During the etching process, the etching time is controlled by naked eyes and measuring resistance.
[0044] Step 6: Such as Figure 7 As shown, a release agent is used to remove the residual resist film, and water and acetone are used for cleaning.
[0045] Step 7: Such as Figure 8 As shown, the thin copper foil and the flexible substrate in contact with it are peeled off the hard sheet to complete the manufacturing process.

PUM

PropertyMeasurementUnit
Thickness0.05 ~ 1.0mm

Description & Claims & Application Information

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