Method of fabricating circuit on ductile flexible substrate

Abstract

The invention provides a method for fabricating a circuit on a ductile flexible substrate. The method includes the steps of flattening a thin copper foil and then fixing the thin copper foil on a hard thin plate to clean an upper surface, which is not in contact with the hard thin plate, of the thin copper foil; fixing a flexible substrate on the cleaned surface of the thin copper foil; peeling off and overturning the flexible substrate and the thin copper foil as a whole from the hard thin plate, fixing the side having the flexible substrate on the hard thin plate, and cleaning the side, which is not in contact with the flexible substrate, of the thin copper foil; fabricating a resist film pattern of the desired circuit on the surface of the thin copper foil; placing the thin copper foil layer with the resist film pattern in a copper etching solution to remove the redundant thin copper foil layer; removing the residual resist film by using a release agent, and washing with water and acetone; and peeling off the thin copper foil and the flexible substrate from the hard thin plate to complete the fabricating process. The method of the invention effectively avoids the problem of mismatch between the metal and the flexible substrate, overcomes the problem of metal wire crack and circuit breakage, and has the characteristics of strong process reliability and low material and process costs.

Description

technical field [0001] The invention belongs to the technical field of flexible electronic device manufacturing, and in particular relates to a method for manufacturing a circuit on an extensible flexible substrate. Background technique [0002] Wearable electronic devices are one of the fastest growing fields in the information industry. One of the key problems restricting the performance and volume of wearable electronic devices is that the rigid substrate printed circuit board (PCB) used cannot meet the requirements for the use of such devices in non-planar environments such as clothing, skin, and organs. A technology for fabricating various functional electronic devices on bendable and extensible flexible substrates. Existing manufacturing of circuit patterns on flexible substrates mainly adopts printed circuit board (FPC) technology based on polyimide (PI) substrate. However, polyimide materials have low elastic properties and poor ductility, and can only be bent but ...

AI Technical Summary

Problems solved by technology

[0005] The main disadvantages of the above technical solutions are: (1) a polyimide transition layer is introduced between the surface of the flexible stretchable material and the metal. On the one hand, the patterning process of polyimide is complicated, which increases the process flow and Cost of production

On the other hand, the polyimide layer with poor stretchability will reduce the overall extensibility of the circuit and also bring about problems such as air permeability

(2) The method of using metal sacrificial layer process or seed layer requires the use of physical deposition process, photoresist or photosensitive polymer, and the required processing cost and material cost are relatively high

Images