Method of fabricating circuit on ductile flexible substrate
A flexible substrate and circuit technology, applied in chemical/electrolytic methods to remove conductive materials, photolithography/patterning, patterning and photolithography, etc., can solve the problem of increasing the circuit manufacturing process and production costs, and reducing the overall extensibility of the circuit , complex polyimide patterning process, etc., to overcome cracks and open circuits, avoid mismatching problems, and reduce equipment dependence
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[0035] Example 1
[0036] Combine Figure 1 to Figure 8 The present invention can be applied to the manufacture of flexible electronic devices with various structures, and there is no requirement on the material, structure, and shape of the circuit. This example is based on the production on polydimethylsiloxane membrane (PDMS) figure 1 The circuit diagram shown is an example to illustrate the implementation method of the present invention. 101 is a circuit interconnection line, 102 is a circuit function module, and 103 is a malleable and flexible substrate of polydimethylsiloxane. In order to adapt to the stretching of the extensible flexible substrate 103, the circuit interconnection line 101 has a curved connection shape with a width of 0.5 mm.
[0037] Step 1: Such as figure 2 As shown, a clean dust-free glass plate is selected as the hard thin plate 104, a small amount of ordinary double-sided tape is pasted on the surface of the glass plate, and the rolled thin copper foil...
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