Method for calibrating chip temperature sensor

Abstract

The invention discloses a method for calibrating a chip temperature sensor, and the method comprises the steps: obtaining an AD code value program, mixing the AD code value program into a function program, formulating a specific starting temperature AD code value function program, and achieving the independence of an original function program; enabling a temperature sensor for measuring an external environment to achieve the interconnection with a tester, achieving the temperature data collection, obtaining an AD temperature code value and environment temperature corresponding to a chip at a testing stage simultaneously, enabling the obtained temperature calibration efficiency to be written into the chip at the same stage, and achieving the calibration of the temperature sensor.

Description

technical field [0001] The invention belongs to the technical field of integrated circuit temperature sensors, in particular to a calibration method for a chip temperature sensor. Background technique [0002] Temperature is a physical quantity that characterizes the degree of coldness and heat of an object, and is a very important measurement parameter in the process of industrial and agricultural production. The effective measurement and control of temperature plays a very important role in energy saving, production safety, product quality assurance, etc., and greatly promotes the development of the national economy. According to statistics, among all kinds of sensor applications, temperature sensors have the highest share, almost half of the applications. According to the contact mode between the sensor and the measured medium, it can be divided into contact type and non-contact type. This article mainly discusses contact type sensors. A long time ago, when semiconducto...

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Problems solved by technology

On the one hand, this method is time-consuming, and needs to obtain the position of each chip through the GPIB of the probe station, write and read text operations; Copy it into the corresponding project of CP3, and at the same time, the positions of CP1 and CP3 wafers must be exactly the same, otherwise the entire wafer will be charged

This time-consuming and highly risky calibration method greatly increases the cost of chip testing to some extent.

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