A manufacturing method of an LED package structure and the LED package structure

Abstract

The invention relates to a manufacturing method of an LED package structure and the LED package structure. The method includes a) providing a conductive frame having a plurality of metal zones and a plurality of communication zones, with at least a part of the metal zones being connected to the communication zones; b) forming a molded part by filling the conductive frame with a resin part; c) cutting off the communication zones on the molded part through a pre-cutting step; and d) cutting the molded part into a plurality of LED package structures through a separation step, wherein the communication zones are disposed on the bottom surface of the molded part and the pre-cutting step is performed on the bottom surface of the molded part.

Description

technical field [0001] The present invention relates to a manufacturing method of a packaging structure and the packaging structure, in particular to a manufacturing method of an LED packaging structure and the LED packaging structure. Background technique [0002] In the manufacturing method of the known LED package structure, the package body formed by transfer molding is usually molded on the metal frame through the mold resin part with a cavity, and then it will be cut directly. Cutting the metal frame and the resin part at the same time. [0003] Therefore, the package formed by the above method will have the feature of "exposing the electrode part at the bottom of the package", and some metal parts will be connected to the electrode part and also exposed on the side surface of the package and connected with the electrode part. The resin part is flush. [0004] In this way, after subsequent processing to form the light-emitting device, when soldering is performed in t...

AI Technical Summary

Problems solved by technology

The exposed metal part will be affected by the external environment, such as metal oxidation, dust coating in the working environment, etc., and then affect the electrical characteristics of the LED packaging structure, resulting in failure of the LED packaging structure

[0005] In addition, as the size of the LED packaging structure is shrinking, the distance between different metal parts exposed on the side surface may be smaller. Therefore, when the LED packaging structure is connected to the external printed circuit board, it may be due to the result of soldering. lead to short circuit

At the same time, because the power of the LED chip is constantly increasing, in the known technology, the electrode and the die-bonding area will be arranged at the same position, so the heat energy emitted by the chip may reduce the effect of conduction, or cause thermal stress to cause the chip to be damaged. Detached from the bonding area of ​​the electrode

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