Heat insulation board with improved structure

A technology of thermal insulation board and thermal insulation layer, which is applied in the field of thermal insulation of board materials, can solve problems such as waste of resources, potential safety hazards, and difficulty in meeting requirements, and achieve the effects of increasing service life, promoting physical health, and reducing labor intensity

Inactive Publication Date: 2017-11-17
马鞍山银色方阵保温板有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The insulation board is easy to understand, it is a board for building insulation. The insulation board is made of polystyrene resin as raw material plus other raw and auxiliary materials and polymers. It is made of polymer mortar, glass fiber mesh cloth, flame retardant It is compounded with molded polystyrene foam board or extruded board and other materials. It is bonded and constructed on site. It is heated and mixed while injecting catalyst, and then extruded to form a rigid foamed plastic board. It has moisture-proof and water-proof properties. , the new thermal insulation and decoration integrated board is produced through the assembly line, which integrates the functions of thermal insulation, waterproof, and decorative surface. The material of choice for energy-saving retrofitting. However, the composite panels in the new insulation panels have not been better configured. If the glue effect is not good, it may fall off, which not only causes safety hazards, but also causes a waste of resources, and requires manual installation, which is time-consuming and laborious
At the same time, through detailed investigation and understanding, people have higher requirements for intelligence, such as: monitoring the humidity of the surrounding environment. If the above functions can be combined to intelligently drive and further control electrical appliances, it can provide people with more life. Great convenience, but the existing devices still have many deficiencies in function, it is difficult to meet the above needs

Method used

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  • Heat insulation board with improved structure

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Embodiment 1

[0018] Such as figure 1 As shown, a structure-improved insulation board of this embodiment includes a base layer 1, a first adhesive 2, an interface layer 3, an insulation layer 4, a protective layer 5, a reinforcement layer 6, a flexible putty 7, a finishing layer 8 and a second Two adhesives; one side of the insulation board is provided with a base layer 1, and the other side of the insulation board is provided with a facing layer 8; the base layer 1 is poured into concrete by the concrete cast-in-place method, and one side of the base layer 1 is provided with an insulation layer 4 for heat preservation The two sides of the layer 4 are supplemented with cement polymer sheets as the surface layer, and an interface layer 3 is arranged between the insulation layer 4 and the base layer 1, and the interface layer 3 is bonded to the base layer 1 and the insulation layer 4 respectively through the first adhesive 2; A reinforced layer 6 is provided on the side of the layer 4 away fr...

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PUM

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Abstract

The invention discloses a heat insulation board with an improved structure and belongs to the field of board heat insulation. The heat insulation board comprises a base layer, a first adhesion agent, an interface layer, a heat insulation layer, a protective layer, a reinforcing layer, flexible putty, a facing layer and a second adhesion agent. The base layer is arranged on one side of the heat insulation board, and the facing layer is arranged on the other side of the heat insulation board. The heat insulation layer is arranged on one side of the base layer, and the interface layer is arranged between the heat insulation layer and the base layer. The side, away from the base layer, of the heat insulation layer is provided with the reinforcing layer, and a glass fiber gridding cloth is arranged in the reinforcing layer. The protective layer is arranged between the heat insulation layer and the reinforcing layer, and the flexible putty is arranged between the reinforcing layer and the facing layer. The heat insulation layer is fixed to the base layer through cement-based plastering waterproof mortar in the interface layer and the cement-based adhesion agents, and the adhesion strength is high. The glass fiber gridding cloth is arranged in the reinforcing layer and forms an organic whole with the heat insulation layer, accordingly, a certain extent of impact damage can be prevented, the anti-impacting performance of the heat insulation board is reinforced, the higher heat degree can be borne, and cracks are reduced.

Description

technical field [0001] The invention relates to the field of thermal insulation of boards, and more specifically relates to a thermal insulation board with improved structure. Background technique [0002] The insulation board is easy to understand, it is a board for building insulation. The insulation board is made of polystyrene resin as raw material plus other raw and auxiliary materials and polymers. It is made of polymer mortar, glass fiber mesh cloth, flame retardant It is compounded with molded polystyrene foam board or extruded board and other materials. It is bonded and constructed on site. It is heated and mixed while injecting catalyst, and then extruded to form a rigid foamed plastic board. It has moisture-proof and water-proof properties. , the new thermal insulation and decoration integrated board is produced through the assembly line, which integrates the functions of thermal insulation, waterproof, and decorative surface. The material of choice for energy-sa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): E04F13/074E04F13/075
CPCE04F13/0875E04F2290/02
Inventor 刘伟
Owner 马鞍山银色方阵保温板有限公司
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