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Natural heat dissipation apparatus of electronic device

A technology of natural heat dissipation and electronic devices, which is applied in the direction of electrical components, structural parts of electrical equipment, and modification through conduction and heat transfer. Low, to ensure the effect of cooling efficiency

Inactive Publication Date: 2017-12-01
XI AN JIAOTONG UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the above-mentioned technical problem that the airflow temperature on the upper part of the vertical flat fins is high and the flow velocity is small, the effect of natural convection heat transfer is deteriorated. Natural heat dissipation device for electronic devices to prolong life and improve equipment reliability

Method used

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  • Natural heat dissipation apparatus of electronic device
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Embodiment Construction

[0023] See attached figure 1 , the heat dissipation device of the present invention comprises a W-shaped heat dissipation fin 1 and a substrate 2 arranged at the bottom of the W-shaped heat dissipation fin 1, and a heat source aluminum plate 3 that is closely attached to the back of the substrate 2, and wraps the heat source aluminum plate 3 The heat-insulating rear shell 4; the corners of the W-shaped heat dissipation fins 1 are disconnected and evenly distributed on the substrate 2. Wherein, the opening angle a of the W-shaped heat dissipation fin 1 is 45° to 90°; the ratio of the dimension d of the disconnected part of the W-shaped heat dissipation fin 1 to the width dimension L of the substrate 2 is d / L=0.03~ 0.10; the ratio l / p of the thickness l of the W-shaped heat dissipation fin 1 to the width dimension L of the fin pitch p=0.05˜0.10.

[0024] The heat generated by the electronic device is transferred to the heat source of the aluminum plate through the heat pipe, an...

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Abstract

Disclosed is a natural heat dissipation apparatus of an electronic device. The heat dissipation apparatus consists of a substrate, and heat dissipation fins and a back shell arranged on the substrate; the heat dissipation fins adopt a W-shaped structure and are arranged perpendicular to the substrate, and the corners of the fins are subjected to interruption treatment; the back shell is manufactured by an insulating material, and is tightly attached to the back part of the substrate; in the working process, the heat dissipation apparatus is perpendicularly arranged; heat generated by the electronic device is transferred from a heat pipe to an aluminum flat plate; the aluminum flat plate is placed in the back shell and then is laminated with the substrate of the heat dissipation apparatus; and finally, heat is dissipated to the environment through the W-shaped heat dissipation fins. By virtue of the specific arrangement mode of the W-shaped heat dissipation fins, the heat dissipation area is enlarged, the contact flow between gas and the fins is reduced, the air inlet amount in the horizontal direction is greatly increased, the heat exchange temperature difference is increased, and natural convection heat exchange efficiency is improved, thereby prolonging the service life of the electronic device and improving reliability of equipment.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation, and in particular relates to a natural heat dissipation device for electronic devices under high heat flux density in chemical industry, metallurgy, air conditioning, electronic communication and other industries that need to strengthen heat dissipation. Background technique [0002] With the rapid development of electronics and communication technology, high-performance chips and integrated circuits are used more and more widely. The development of the electronics industry has always followed Moore's Law: when the price remains constant, the number of transistors that can be accommodated on an integrated circuit will double every 18 to 24 months, and the performance will also double. Therefore, the power of the electronic device chip is continuously increasing, and the volume of the equipment is decreasing day by day, which leads to the continuous increase of the heat flux on the unit s...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/2039H05K7/20127
Inventor 何雅玲张凯王飞龙汤松臻朱月
Owner XI AN JIAOTONG UNIV
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