Cushioning component and press-fit device

Abstract

The invention discloses a cushioning component and a press-fit device. The cushioning component is used in the press-fit device. The press-fit device comprises an anisotropic conductive adhesive film pressure cutter. The cushioning component comprises an embedded portion and a cushioning portion. The embedded portion is made of first elastic materials and is used for being embedded and mounted in the lower end of the anisotropic conductive adhesive film pressure cutter; the cushioning portion is made of second elastic materials and clings to the lower end surface of the lower end of the anisotropic conductive adhesive film pressure cutter. The cushioning component and the press-fit device have the advantages that the cushioning component comprises the embedded portion and the cushioning portion, the embedded portion is embedded in the press-fit device, and accordingly the cushioning component can be firmly fixed onto the press-fit device and can be prevented from falling off; the cushioning component with an embedded structure is convenient to replace and manage; the cushioning portion is made of the elastic materials and clings to the lower surface of the press-fit device, accordingly, cushioning effects can be realized when the press-fit device works, and the attaching success rate can be increased.

Description

technical field [0001] The invention relates to the technical field of processing equipment, in particular to a pressing device for attaching anisotropic conductive film (ACF for short) on a display panel and a buffer on the device. Background technique [0002] With the rapid development of electronic products towards lightness, thinness, shortness and miniaturization, almost all kinds of portable electronic products use liquid crystal displays as display panels, and liquid crystal displays are already important components. In addition to the LCD panel, the liquid crystal display must be connected with a driver chip on its periphery for the purpose of controlling the display signal. Among them, we can use ACF thermocompression welding technology to join the LCD panel and the driver chip. The ACF thermocompression welding technology uses ACF to bond the IC or integrated circuit on the LCD glass substrate through pre-pressing. During pre-pressing, different buffers on the pr...

AI Technical Summary

Problems solved by technology

The ACF thermocompression welding technology uses ACF to bond the IC or integrated circuit on the LCD glass substrate through pre-pressing. During pre-pressing, different buffers on the pressing device will affect the success rate of attachment. The existing Buffers are mainly wrap-type buffers and box-type buffers. The wrap-type buffers are not fixed firmly, and they are easy to fall off when used. The failure rate of attachment is high, greater than 2%. It is easy to touch the product and cause fragments, which is inconvenient to use and replace, which affects the efficiency of the attachment machine

Moreover, these two kinds of cushioning parts are replaced frequently, basically once every two days, and the replacement time is long, all needing 10 minutes, resulting in long downtime and low work efficiency

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