OLED substrate and manufacturing method and display apparatus

A manufacturing method and substrate technology, applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve problems such as easy disconnection of electrode leads, and achieve reliable molding, simple and reliable process, and reliable connection.

Active Publication Date: 2017-12-08
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide an OLED substrate, a manufacturing method, and a display device, which are use

Method used

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  • OLED substrate and manufacturing method and display apparatus
  • OLED substrate and manufacturing method and display apparatus
  • OLED substrate and manufacturing method and display apparatus

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0064] see figure 2, in the OLED substrate provided in Embodiment 1, the active layer 21 of the thin film transistor is arranged on the base substrate 1, and the gate insulating layer 10 is arranged on the active layer 21, and the gate insulating layer 10 corresponds to the surface of the active layer 21 A gate 22 is provided, and the gate insulating layer 10 is located on the surface of the peripheral wiring area B, and a signal line 5 on the same layer as the gate 22 is provided; the gate 22, the gate insulating layer 10 and the signal line 5 are all covered with an interlayer insulating layer 11, and part of the signal line 5 is covered by the interlayer insulating layer 11, partly exposed outside the edge of the interlayer insulating layer 11; the surface of the interlayer insulating layer 11 corresponding to the active layer 21 is provided with a source and drain 23, and the source and drain 23 includes a source electrode and a drain electrode, and the source electrode a...

Embodiment 2

[0072] see image 3 , in the OLED substrate provided in the second embodiment, the structure of the thin film transistor, the structure of the OLED, the position of the signal line 5 and the arrangement of the functional film layer between the signal line 5 and the OLED cathode 33 are all the same as those of the first embodiment.

[0073] In the OLED substrate provided in this embodiment, the electrode leads include a first segment of sub-segment leads 91 connected to the portion of the signal line 5 not covered by the interlayer insulating layer 11, and a first segment of sub-segment leads 91 overlapping with the first segment of sub-segment leads 91. Two segments of sub-segment leads 92, and the second segment of sub-segment leads 92 are connected to the cathode 33 of the OLED.

[0074] Specifically, the first segment of sub-segment lead 91 is correspondingly arranged on the edge surface of the interlayer insulating layer 11, and the first segment of sub-segment lead 91 and...

Embodiment 3

[0076] see Figure 4 , in the OLED substrate provided in the third embodiment, the structure of the thin film transistor, the structure of the OLED, the position of the signal line 5 and the functional film layer between the signal line 5 and the OLED cathode 33 are all the same as the first embodiment.

[0077] In the OLED substrate provided in this embodiment, the electrode leads include a first subsection lead 91 connected to the part of the signal line 5 not covered by the interlayer insulating layer 11, and a second subsection lead 91 overlapping the first section subsection lead 91. A sub-segment lead 92, and a third sub-segment lead 93 overlapped with the second sub-segment lead 92, and the third sub-segment lead 93 is connected to the cathode 33 of the OLED.

[0078] Specifically, the first segment of sub-segment lead 91 is correspondingly arranged on the edge surface of the interlayer insulating layer 11, and the first segment of sub-segment lead 91 and the source and...

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Abstract

The invention discloses an OLED substrate and a manufacturing method and a display apparatus, relates to the technical field of display, and aims to solve the problem of easy wire breaking of an electrode lead so as to ensure normal display of the OLED display apparatus. The OLED substrate comprises an array substrate with a display region and a peripheral wiring region; multiple OLEDs in array arrangement are arranged in the display region; each OLED comprises an upper electrode and a lower electrode arranged oppositely, and an OLED light emitting layer positioned between the upper electrode and the lower electrode, and the lower electrode is formed on the surface of the array substrate; the peripheral wiring region is provided with a functional film layer and a signal line; the functional film layer partially covers the signal line; an electrode lead is arranged on the surface of the edge of the functional film layer; and one end of the electrode lead is connected with the part, not covered by the functional film layer, of the signal line, while the other end is connected with the corresponding upper electrode. The OLED substrate provided by the invention is used for OLED display.

Description

technical field [0001] The invention relates to the field of display technology, in particular to an OLED substrate, a manufacturing method, and a display device. Background technique [0002] Organic Light Emitting Diode (OLED for short) is widely used in the field of display due to its advantages of high brightness, full viewing angle, fast response speed and flexible display. [0003] Currently, OLEDs commonly used in OLED substrates mainly include top-emitting OLEDs, bottom-emitting OLEDs, and double-sided emitting OLEDs. Among them, the structure of the OLED substrate using top-emitting OLED is as follows figure 1 As shown, the OLED substrate includes an array substrate having a display area A and a peripheral wiring area B, and the OLED array is disposed on the surface of the array substrate located in the display area A. The anode 31 of the OLED is formed on the side of the thin film transistor 2 facing away from the substrate 1 by using indium tin oxide (Indium Tin...

Claims

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Application Information

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IPC IPC(8): H01L27/32H01L21/56
CPCH01L21/56H10K59/131
Inventor 程鸿飞张玉欣
Owner BOE TECH GRP CO LTD
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