Method for removing epoxy resin adhesive on surface of polycrystalline silicon

Abstract

The present invention discloses a method for removing an epoxy resin adhesive on the surface of polycrystalline silicon. The method comprises the following steps that: 1) a silicon material of which the surface is bonded with the epoxy resin adhesive is arranged in a nitric acid aqueous solution so as to be subjected to oxidation treatment; 2) the silicon material which has been subjected to the oxidation treatment is rinsed in pure water, so that the silicon material can be neutral; 3) the epoxy resin adhesive on the surface of the rinsed silicon material is removed; and 4) epoxy resin adhesive residuals on the surface of the silicon material are scrubbed with alcohol so as to be wiped out. The method of the present invention has high removal efficiency, can reduce low processing costs and facilitate subsequent processing.

Description

technical field [0001] The invention relates to the field of polycrystalline silicon solar cells, and more particularly, relates to a method for removing epoxy resin adhesive on the surface of polycrystalline silicon. Background technique [0002] In recent years, with the depletion of non-renewable energy sources, solar cells have been developed rapidly. Since the preparation process of cast polysilicon is relatively simple and the cost is much lower than that of monocrystalline silicon, polysilicon gradually replaces the dominant position of Czochralski monocrystalline silicon in the solar cell material market and becomes the most important photovoltaic material in the industry. Polysilicon material is the most important raw material in the entire polysilicon wafer production process. With the increasingly fierce competition in the industry, the polysilicon ingot industry will develop in the direction of large input, high efficiency, and low cost. [0003] In the conventi...

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Problems solved by technology

[0003] In the conventional process, the crystal brick is glued to the glass and fixed in the slicer for cutting. In the process of sticking the crystal brick to the glass, the end face of the crystal brick will be stained with epoxy resin adhesive. The end face of the medium crystal brick will be preserved. The thickness of the thick piece of the dividing line is about 5-10mm, and the surface is covered with cured adhesive. Since the thickness of the thick piece is about 5-10mm, it is difficult to handle. Polish the silicon through a grinder. The material loss is large and the silicon material is easily broken. The broken silicon material is difficult to polish due to its small size, and the scrap rate is high.

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