Method for processing slurry after cutting of silicon material and system thereof
A technology of silicon material and silicon carbide slurry, which is applied in the field of material engineering, can solve the problems of increased process cost, high material cost, and needs to be improved, and achieve the effect of reducing production cost
Pending Publication Date: 2017-12-19
CHINA ENFI ENGINEERING CORPORATION
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Problems solved by technology
[0002] The processing of silicon materials generally adopts the diamond sand wire cutting process, including squaring, slicing and other processes. Although the material loss caused by the wire cutting process is the smallest in the machining field, due to the high cost of the material itself, if the cuttings are directly discarded Going, it will cause the process cost to increase
[0003] Therefore, the existing means of processing the slurry after silicon material cutting still needs to be improved
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[0025] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.
[0026] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counterclockwise", "Axial" , "radial", "circumferential" and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, which are only for the convenience of describing the ...
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The invention discloses a method for processing a slurry after cutting of a silicon material and a system thereof. The method comprises the following steps: cutting the silicon material and filtering the slurry to recover polyethylene glycol, and obtaining a filter cake; washing the filter cake by washing liquid and filtering the filter cake to remove the iron in the filter cake; mixing the filter cake after the iron is removed and water, slurrying a mixture and supplying the mixture to a solid-solid separating device for solid-solid separating treatment to respectively obtain a silicon powder slurry and a silicon carbide slurry; and respectively filtering the silicon powder slurry and the silicon carbide slurry to obtain the silicon powder and silicon carbide. The method can be used for respectively recovering the silicon powder and silicon carbide in the slurry after cutting of the silicon material, recovers polyethylene glycol, and can obviously reduce the production cost.
Description
technical field [0001] The invention relates to the field of material engineering, in particular, the invention relates to a method and a system for processing slurry after silicon material cutting. Background technique [0002] Silicon material processing generally adopts the diamond sand wire cutting process, including square cutting, slicing and other processes. Although the material loss caused by the wire cutting process is the smallest in the machining field, due to the high cost of the material itself, if the cutting material is directly discarded Going, it will cause the process cost to increase. [0003] Therefore, the existing means of processing the slurry after silicon material cutting still needs to be improved. Contents of the invention [0004] The present invention aims to solve one of the technical problems in the related art at least to a certain extent. To this end, an object of the present invention is to propose a method and a system for processing s...
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IPC IPC(8): C01B33/037C01B32/956C08J11/06C08L71/02
CPCC01B33/037C08J11/06C08J2371/02Y02W30/62
Inventor 孙宁磊刘苏宁王霄彭建华刘国
Owner CHINA ENFI ENGINEERING CORPORATION