Heat radiating method of radiator for communication equipment

A heat dissipation method and technology of a heat dissipation device, which are applied in the direction of temperature control using digital devices, measuring devices, and structural parts of electrical equipment, etc., which can solve the problem of low heat dissipation efficiency, failure to meet the heat dissipation requirements of communication equipment, and the inability to install high-power heat dissipation and cooling Device and other issues, to achieve reliable heat dissipation, maximize heat exchange efficiency, and improve service life

Active Publication Date: 2017-12-26
STATE GRID ZHEJIANG HANGZHOU YUHANG POWER SUPPLY +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Under high temperature conditions in summer, communication equipment needs to be installed with an air temperature regulator to enable the communication equipment to dissipate heat in time. Closed places, these places are limited by the space environment and cannot be installed with ordinary high-power cooling devices, so usually a radiator is installed on the communication equipment, and a fan is installed on the radiator, and the airflow generated by the fan accelerates the heat dissipation of the radiator. However, this cooling method The heat dissipation efficiency is low, which cannot meet the heat dissipation requirements of communication equipment

Method used

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  • Heat radiating method of radiator for communication equipment
  • Heat radiating method of radiator for communication equipment
  • Heat radiating method of radiator for communication equipment

Examples

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Effect test

Embodiment 1

[0040] Such as Figures 1 to 3As shown, the present invention provides a heat dissipation method for a heat dissipation device of communication equipment. The heat dissipation device includes a housing 1, a radiator 2, a semiconductor cooling chip 3 and a fan 4. The semiconductor cooling chip 3 has low power consumption and low noise. It is reliable in use and is very suitable for narrow spaces. The semiconductor cooling chip 3 includes a cooling surface 31 and a heat dissipation surface 32. Both the cooling surface 31 and the heat dissipation surface 32 are coated with heat-conducting silicone grease. The housing 1 includes a main end surface 11, a first end surface 12 and The second end face 13, the first end face 12 and the second end face 13 are arranged on the two ends of the main end face 11, the main end face 11 and the first end face 12, the second end face 13 are integrally arranged and are "Π" type, and the semiconductor refrigeration sheet 3 is inlaid On the main en...

Embodiment 2

[0047] Such as Figures 4 to 6 As shown, the main difference between this embodiment and Embodiment 1 is that this embodiment adds a temperature detection step, a temperature display step and a setting step.

[0048] The heat dissipation device also includes a temperature controller 6 and an LED display 7. The temperature controller 6 includes a temperature control probe 61, an MCU and a setting button 62. The temperature control probe 61 is provided with a temperature sensor for measuring the surface temperature of the communication device. The temperature control probe 61 is connected with MCU by wire, MCU is connected with semiconductor refrigeration sheet 3 by wire, preset temperature is set in MCU, setting button 63 is connected with MCU by wire and can set preset temperature, LED display 7 and MCU are connected by wire It is connected and can display the surface temperature of communication equipment in real time.

[0049] The cooling method of this embodiment includes ...

Embodiment 3

[0057] Such as Figure 7 As shown, the main difference between the present embodiment and the second embodiment is that an adjustment step is added in the present embodiment.

[0058] The heat dissipation device also includes a regulating switch, and the regulating switch is connected with the semiconductor refrigeration sheet through wires.

[0059] The cooling method of this embodiment includes the following steps:

[0060] Preliminary heat dissipation steps: the radiator starts to work, the radiator dissipates the heat transferred from the communication equipment, the fan starts to work, and the fan provides sufficient airflow to the radiator to form air convection around the radiator to speed up the heat dissipation of the radiator.

[0061] Adjustment step: adjust the cooling power of the semiconductor refrigeration sheet in the cooling step by adjusting the switch. This step enables the cooling power of the semiconductor refrigerating sheet to be adjusted according to ...

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Abstract

The invention provides a heat radiating method of a radiator for communication equipment. The heat radiating method at least includes an initial heat radiation step, a refrigerating step and a condensate water treatment step. In the initial radiation step, the radiator starts working and radiates heat transmitted by the communication equipment, a fan starts working and provides sufficient air flows to the radiator to form air convection around the radiator, and heat radiation of the radiator is accelerated. In the refrigerating step, a semi-conductor refrigerating piece works to reduce the temperature around the refrigerating surface thereof. In the condensate water treatment step, air-convection heat radiation of the refrigerating surface of the semi-conductor refrigerating piece is achieved by the air flows generated by the fan through flow guide wind tunnels so as to reduce condensate water generated by working of the semi-conductor refrigerating piece and accelerate evaporation of the condensate water. Through the initial heat radiation step, the refrigerating step and the condensate water treatment step, heat radiation efficiency of the radiator is improved, and the communication equipment is prevented from being influenced by the condensate water.

Description

technical field [0001] The invention relates to a heat dissipation method of a heat dissipation device, in particular to a heat dissipation method for a heat dissipation device of communication equipment. Background technique [0002] Under high temperature conditions in summer, communication equipment needs to be installed with an air temperature regulator to enable the communication equipment to dissipate heat in time. Closed places, these places are limited by the space environment and cannot be installed with ordinary high-power cooling devices, so usually a radiator is installed on the communication equipment, and a fan is installed on the radiator, and the airflow generated by the fan accelerates the heat dissipation of the radiator. However, this cooling method The heat dissipation efficiency is low, which cannot meet the heat dissipation requirements of communication equipment. Contents of the invention [0003] The purpose of the present invention is to provide a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20G05D23/19G01K1/02G01K13/00
CPCH05K7/20145H05K7/20172H05K7/20209H05K7/2039G05D23/1917G01K1/02G01K13/00
Inventor 丁力邵炜平沈文佳屠永伟姚海燕胡晓琴包拯民沈艳婷卢科帆
Owner STATE GRID ZHEJIANG HANGZHOU YUHANG POWER SUPPLY
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