Aluminum alloy electronic chip tray and preparation process thereof

A technology of electronic chip and preparation process, which is applied in the manufacture of circuits, electrical components, semiconductors/solid-state devices, etc. It can solve the problems of high appearance quality and product flatness, poor impact resistance, and short service life of aluminum alloy die-casting parts. problems, to achieve the effect of good appearance quality, small thermal deformation and good corrosion resistance

Active Publication Date: 2017-12-29
ZHUHAI RUNXINGTAI ELECTRICAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing plastic pallets have the problems of poor rigidity and poor impact resistance, and the aging of plastics will easily lead to a short service life; sheet metal pallets have problems such as heavy weight and high cost.
[0004] The aluminum alloy tray has the characteristics of light weight and good mechanical properties, but it is still in the research and development stage, mainly because the thermal deformation of the aluminum alloy die-casting is relatively large, and the residual stress of the die-casting of the casting will cause the tray to deform during use. In addition, it is used as Aluminum alloy die-casting parts for electronic chip trays have high requirements for appearance quality and product flatness

Method used

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  • Aluminum alloy electronic chip tray and preparation process thereof
  • Aluminum alloy electronic chip tray and preparation process thereof
  • Aluminum alloy electronic chip tray and preparation process thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0053] In the pulping process, the ADC12 aluminum alloy material is selected for the preparation of semi-solid slurry. The aluminum alloy raw material is smelted in a smelting furnace, refined and degassed, and then a liquid alloy is obtained. As a pulping equipment, the liquid alloy in the spoon is mechanically stirred during the cooling process, and the mechanical stirring speed is 1200 rpm to obtain a semi-solid slurry with spherical crystals; the temperature of the semi-solid slurry is 595 ℃, and the solid phase ratio Is 43%;

[0054] In the rheological die-casting process, the above semi-solid slurry is filled into the mold cavity under the action of the die-casting machine. The mold cavity roughness Ra is 1.8μm; the matching gap of the mold parting surface is 0.02mm. After the filling is completed, increase the pressure, and Vacuum die-casting is performed to obtain a die-casting blank; wherein the cavity vacuum is 60mbar, the pumping time is 0.5s, and the boost pressure is...

Embodiment 2

[0057] In the pulping process, the ADC12 aluminum alloy material is selected for the preparation of semi-solid slurry. The aluminum alloy raw material is smelted in a smelting furnace, refined and degassed, and then a liquid alloy is obtained. As a pulping equipment, the liquid alloy in the spoon is mechanically stirred during the cooling process. The mechanical stirring speed is 1200 rpm to prepare a semi-solid slurry with spherical crystals; the temperature of the semi-solid slurry is 600 ℃, and the solid phase The rate is 42%;

[0058] In the rheological die-casting process, the semi-solid slurry is filled into the mold cavity under the pressure of the die-casting machine. The mold cavity roughness Ra is 1.8μm; the matching gap of the mold parting surface is 0.02mm. Increase the pressure after the filling is completed, and Vacuum die-casting is performed to obtain a die-casting blank; wherein the cavity vacuum is 60mbar, the pumping time is 0.5s, and the boost pressure is 240M...

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Abstract

The invention provides a preparation process of an aluminum alloy electronic chip tray. The electronic chip tray is produced through a semi-solid rheo-diecasting process. The production process specifically comprises a pulping procedure, a rheo-diecasting procedure and an aging treatment procedure. Vacuum die casting is adopted as a die casting manner. The aluminum alloy electronic chip tray prepared through the preparation process has the excellent performance of an aluminum material, effectively overcomes the technical problem that an aluminum alloy material is prone to deforming when heated, is small in heat deformation and has excellent appearance quality and anti-static performance; the market application of the electronic chip tray is opened up; the application field of die castings is expanded; and the aluminum alloy electronic chip tray produced through the preparation process is further requested to be protected.

Description

Technical field [0001] The invention relates to the field of die-casting production, in particular to a preparation process of an aluminum alloy electronic chip tray and a prepared product thereof. Background technique [0002] Electronic chip trays are shells used to install semiconductor integrated circuit chips, which have the functions of placing, fixing, sealing, protecting chips and enhancing electrothermal performance. Most of them are used on electronic products and electronic parts. The trays are generally used as external chips. Packaging or as a carrier for baking tests has important applications in the field of semiconductor integrated circuits. [0003] At present, the packaging trays used in electronic products in the industry mainly include plastic trays formed by blister, including PE trays, ABS trays, etc., as well as sheet metal trays produced by stamping. The packaged tray must have good mechanical properties and high temperature resistance, that is, the tray wi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22D17/14B22D31/00C22F1/043C22C21/02H01L21/673
CPCB22D17/007B22D17/14B22D31/002C22C21/02C22F1/043H01L21/67336
Inventor 任怀德张莹王继成李谷南
Owner ZHUHAI RUNXINGTAI ELECTRICAL
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