A kind of polysulfone insulating film and preparation method thereof

A technology of insulating film and polysulfone film, which is applied in the field of high-temperature-resistant polysulfone insulating film and its preparation, can solve the problems of high breakdown field strength, lower material heat resistance and insulation breakdown strength, and inability to prepare insulating film. Achieve high mechanical properties and outstanding thermal stability

Active Publication Date: 2020-02-18
四川斯派恩新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The sulfone polymer material used in the present invention has the characteristics of high temperature resistance and high breakdown field strength, but due to the strong interaction between its molecular chains, it is impossible to prepare insulating films by ordinary melt casting method
However, it is difficult to completely remove the solvent in the pouring solution through the ordinary solution casting method, and the residual solvent will significantly reduce the heat resistance and insulation breakdown strength of the material, so it is impossible to obtain a high-performance polysulfone insulation film

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Dissolve PASS in N-methylpyrrolidone to prepare a casting solution with a concentration of 20%. After the casting solution is cast and coated, it is exposed to an air atmosphere with a relative humidity of 95% at room temperature for 2 minutes. At this time, the surface of the liquid film The microporous structure is formed by phase separation and becomes opaque; then microwave heating is used to raise the temperature of the liquid film to 80°C, 120°C, 160°C, 200°C, 240°C, and 280°C, and keep at each temperature for 5 minutes to make the casting The solvent in the membrane solution gradually evaporates completely and closes the micropores. The formed film was slowly cooled to room temperature and wound up. The prepared PASS insulation film has a temperature resistance of 210°C, a room temperature tensile strength of 130MPa, and a dielectric strength of 300kV / mm.

Embodiment 2

[0021] Dissolve PPSU in dimethylacetamide to prepare a casting solution with a concentration of 25%. After the casting solution is cast and coated, it is exposed to an air atmosphere with a relative humidity of 90% at room temperature and kept for 4 minutes. At this time, the surface of the liquid film passes through phase Separate to form a microporous structure and become opaque; then use microwave heating to raise the temperature of the liquid film to 80°C, 120°C, 160°C, 200°C, 240°C, 280°C, and keep at each temperature for 5 minutes to make the casting liquid The solvent in the solution gradually evaporates completely and closes the micropores. The formed film was slowly cooled to room temperature and wound up. The prepared PPSU insulation film has a temperature resistance of 220°C, a room temperature tensile strength of 180MPa, and a dielectric strength of 320kV / mm.

Embodiment 3

[0023] Dissolve m-PSA in dimethyl sulfoxide to prepare a casting solution with a concentration of 24%. After the casting solution is cast and coated, it is exposed to an air atmosphere with a relative humidity of 93% at room temperature and kept for 5 minutes. At this time, the surface of the liquid film The microporous structure is formed by phase separation and becomes opaque; then microwave heating is used to raise the temperature of the liquid film to 100°C, 140°C, 180°C, 220°C, 260°C, 300°C, and keep at each temperature for 5 minutes to make the casting The solvent in the membrane solution gradually evaporates completely and closes the micropores. The formed film was slowly cooled to room temperature and wound up. The prepared PPSU insulation film has a temperature resistance of 260°C, a room temperature tensile strength of 200MPa, and a dielectric strength of 400kV / mm.

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PUM

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Abstract

The invention relates to the technical field of high polymer materials, in particular to a heat-resistant polysulfone insulation film and a preparation method thereof. The preparation method includes: preparing a polysulfone solution film with a solution salivation method, and then establishing a micropore structure on the polysulfone solution film; heating and removing the solvent to have micropores closed by adopting a gradual heating method to obtain the polysulfone insulation film. The obtain insulation material is high in mechanical property and heat stability and outstanding in insulation breakdown strength and durability as compared with that with a traditional method, and heat-resistant grade of the insulation film can be upgraded to N-grade to R-grade from F-grade or H-grade; heat-resistant temperature of the polysulfone insulation film is 200-260DEG C, room temperature tensile strength is 100-200MPa, and dielectric strength is 200-400kV / mm.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a high-temperature-resistant polysulfone insulating film and a preparation method thereof. Background technique [0002] Insulating film is a film material with wide application value in the field of electronic appliances, and its performance mainly depends on the properties of the film material itself. It is generally required that such films have high resistivity and breakdown field strength. In addition, generally according to the heat resistance grade of the insulating material, the insulating film is divided into A grade, E grade, B grade, F grade, H grade, C grade, N grade, R grade, etc. At present, the organic insulating film (H grade) with the highest heat resistance level on the market is mainly polyimide film, but because the polyimide material itself has a small amount of defects in the manufacturing process, its breakdown field strength is generally relativ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08J5/18C08J3/28
CPCC08J3/28C08J5/18C08J2381/06
Inventor 王孝军杨杰张刚张美林龙盛如
Owner 四川斯派恩新材料有限公司
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