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PCB and its manufacturing method
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A manufacturing method and printed circuit board technology, applied in the direction of multilayer circuit manufacturing, electrical connection printed components, printed circuit components, etc., can solve problems such as poor pad adhesion, increase capacity, solve pad adhesion poor effect
Active Publication Date: 2022-01-28
ZTE CORP
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Abstract
Description
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[0005] Embodiments of the present invention provide a printed circuit board PCB and a manufacturing method to at least solve the problem of poor pad adhesion in the related art
Method used
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Embodiment 1
[0032] In this embodiment a PCB is provided, image 3 is a cross-sectional view of a printed circuit board PCB according to an embodiment of the present invention, such as image 3 As shown, the PCB includes:
[0033] The first outer layer 1 at least includes: a first bottom substrate 13, and a solder resist layer 11 and a first pad 12 disposed on the first bottom substrate 13;
[0034] The second outer layer 2 is disposed under the first outer layer 1, and the second outer layer 2 at least includes: a second bottom base material 22, and a second solder joint disposed on the second bottom base material 22. disc 21;
[0035] Optionally, the above-mentioned first pad 12 and second pad 21 may be a copper foil defined pad NSMD and a solder resist defined pad SMD.
[0036] Optionally, the second outer layer 2 may be disposed below the first outer layer 1 .
[0037] It should be pointed out that the second bottom base station of the second outer layer 2 can be provided with a so...
Embodiment 2
[0063] In this embodiment, a method for manufacturing a printed circuit board PCB is also provided. Figure 8 It is a flowchart of a method for manufacturing a printed circuit board PCB according to an embodiment of the present invention, such as Figure 8 shown, including the following steps:
[0064] S802, arranging the first outer layer 1 above the second outer layer 2 by pressing;
[0065] Optionally, the first outer layer 1 can be arranged above the second outer layer 2 .
[0066] S804, creating one or more blind holes 3 on the first pad 12 in the first outer layer 1 and the second pad 21 in the second outer layer 2;
[0067] Optionally, the first pad 12 and the second pad 21 may be a copper foil defined pad (NSMD) and a solder mask defined pad SMD.
[0068] Optionally, the size ratio between the first pad 12 and the second pad 21 is 1:1.
[0069] Optionally, in order to avoid affecting signaltransmission performance, the size of the second pad 21 is smaller than or ...
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Abstract
The invention provides a printed circuit board PCB and a manufacturing method thereof. Specifically, the PCB includes: a first outer layer, at least including: a first bottom substrate, and a solder resist layer and a first pad disposed on the first bottom substrate; a second outer layer, disposed on Below the first outer layer, the second outer layer at least includes: a second bottom substrate, and a second pad disposed on the second bottom substrate; one or more blind holes, penetrating through The first pad and the second pad are used to connect the first pad and the second pad. Based on the above-mentioned printed circuit board PCB, the problem of poor adhesion of the pads is solved, thereby achieving the effect of increasing the ability of the pads to attach to the substrate.
Description
technical field [0001] The present invention relates to the field of PCB design, in particular to a printed circuit board (Printed Circuit Board, PCB for short) and a manufacturing method thereof. Background technique [0002] In view of the current radio frequency requirements for grounding resistance of shrapnel, usually shrapnel is made of berylliumbronze, grade C17200, which belongs to precipitation hardening alloy. After solid solution aging treatment, it has high strength, hardness, elastic limit and fatigue limit, and the elastic hysteresis is small. Metal shrapnel are widely used, mainly used in the connection of FPC or LDS antenna. [0003] As smartphones become more and more widely used, in order to meet the requirements of different frequency bands at the same time, mobile phone motherboards need to be compatible with different frequency band antenna designs, so the number of antenna shrapnel used in low-end mobile phones has increased significantly. The layout ...
Claims
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Application Information
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