Lead-free high-temperature soldering paste for mobile phone and computer motherboard and preparation method thereof

A high-temperature welding and computer technology, applied in welding equipment, welding medium, manufacturing tools, etc., can solve the problems of low activation temperature, no activity, damage, etc.

Active Publication Date: 2018-01-12
XIAMEN UNIV OF TECH
View PDF7 Cites 12 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The active ingredient of solder paste is the key parameter of solder paste. In the past, the active temperature of some solder pastes was too low, that is, the activity would be released at room temperature, which might destroy the oxides on the surface of the alloy solder powder in advance, causing the solder powder to agglomerate
If the activation temperature is too high, it will cause no activity in the SMT reflow process and affect the soldering effect

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0030] The invention discloses a lead-free high-temperature solder paste for mobile phones and computer mainboards, which consists of the following components by weight percentage: 46% resin, 18% solvent, 7% thixotropic agent, 28% activator and corrosion inhibitor 0.5%, antioxidant 0.5%. Under this proportioning, the effect of the product of the present invention is the best.

[0031] Preferably, the resin is specifically AR120 rosin, Poral AX-E resin, polyisobutylene 300R. It can be purchased directly from the market.

[0032] Preferably, the solvent is specifically tetraethylene glycol dimethyl ether. As a carrier, the solvent can well dissolve the resin and active agent, and provide a suitable viscosity for the final produced solder paste. At the same time, the solvent has a high boiling point, which can ensure that the solder paste will not harden due to premature volatilization of the solvent during reflow soldering, and can make the active agent play a role in the ent...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a lead-free high-temperature soldering paste for a mobile phone and computer motherboard and a preparation method thereof. The soldering paste is prepared from the following components in percentages by weight: 46% of resin, 18% of a solvent, 7% of a thixotropic agent, 28% of an activator, 0.5% of a corrosion inhibitor and 0.5% of an antioxidant. The invention also discloses a preparation method thereof. By selecting raw materials, adjusting a production process, controlling the viscosity, thixotropy and active releasing time precisely and matching with a reflux curve in an SMT reflux process, defects easily generated in precision welding can be reduced to the maximum extent.

Description

technical field [0001] The invention belongs to the technical field of solder paste for soldering in the electronic industry, and relates to a lead-free high-temperature solder paste for mobile phones and computer mainboards and a preparation method thereof. Background technique [0002] Solder paste is one of the most commonly used electronic accessories in the electronics industry and plays a very important role in the electronics industry. Solder paste is a paste-like substance, which is made by mixing and stirring alloy solder powder and solder paste. Among them, alloy solder powder is a spherical powder, which is divided into high-temperature, medium-temperature, and low-temperature alloys according to the melting point of the alloy in industrial applications. The most commonly used high-temperature alloys are tin-silver-copper alloys (SnAg3.0Cu0.5, SnAg1.0Cu0.5, SnAg0.3Cu0.7), the most commonly used medium-temperature alloys are tin-lead alloys (Sn63Pb37), and the mos...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/36B23K35/363B23K35/40
Inventor 简旻坤
Owner XIAMEN UNIV OF TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap