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A kind of low dielectric constant glass fiber reinforced polyamide material and preparation method thereof

A technology with low dielectric constant and dielectric constant, applied in the field of polyamide materials, can solve the problems of large signal loss and achieve the effect of meeting the needs of injection molding, excellent fluidity, and simple operation of the preparation process

Active Publication Date: 2021-02-12
ORINKO NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the dielectric constant of plastic materials commonly used at present is 3.8-3.9, and the dielectric constant value is relatively large, and the signal loss is also large

Method used

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  • A kind of low dielectric constant glass fiber reinforced polyamide material and preparation method thereof
  • A kind of low dielectric constant glass fiber reinforced polyamide material and preparation method thereof
  • A kind of low dielectric constant glass fiber reinforced polyamide material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A glass fiber-reinforced polyamide material with low dielectric constant consists of the following components in parts by weight:

[0024]

[0025] (1) Dry PA66 at 100°C for 3 hours, then add PA66, PA6I / 6T (DuPont 3426), zeolite, antioxidant and lubricant into the high mixer and mix for 2-5 minutes;

[0026] (2) Put the mixed material through the main feeding port, and the alkali-free glass fiber treated with KH-550 is fed into the twin-screw extruder through the side feeding port, and then melted, extruded and granulated to obtain low dielectric constant Glass fiber reinforced polyamide material. Among them, the extruder barrel temperature is set to 190°C, 220°C, 230°C, 250°C, 270°C, 265°C, 265°C, 265°C, 240°C, the screw speed is 450r / min, and the vacuum degree is -0.06MPa .

Embodiment 2

[0028] A glass fiber-reinforced polyamide material with low dielectric constant consists of the following components in parts by weight:

[0029]

[0030] (1) Dry PA66 at 100°C for 3 hours, add PA66, PA6I / 6T (DuPont 3426), zeolite, antioxidant, and lubricant together in a high mixer and mix for 2-5 minutes;

[0031] (2) Put the mixed material through the main feeding port, and the alkali-free glass fiber treated with KH-560 is fed into the twin-screw extruder through the side feeding port, and then melted, extruded and granulated to obtain low dielectric constant Glass fiber reinforced polyamide material. Among them, the extruder barrel temperature is set to 190°C, 220°C, 230°C, 250°C, 270°C, 265°C, 265°C, 265°C, 240°C, the screw speed is 450r / min, and the vacuum degree is -0.06MPa .

Embodiment 3

[0033] A glass fiber-reinforced polyamide material with low dielectric constant consists of the following components in parts by weight:

[0034]

[0035] (1) Dry PA66 at 110°C for 4 hours, add PA66, PA6I / 6T (DuPont 3426), zeolite, antioxidant and lubricant into the high mixer and mix for 2-5 minutes;

[0036] (2) Put the mixed material through the main feeding port, and the alkali-free glass fiber treated with A-151 is fed into the twin-screw extruder through the side feeding port, and then melted, extruded and granulated to obtain low dielectric constant Glass fiber reinforced polyamide material. Among them, the extruder barrel temperature is set to 190°C, 220°C, 230°C, 250°C, 270°C, 265°C, 265°C, 265°C, 240°C, the screw speed is 450r / min, and the vacuum degree is -0.06MPa .

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Abstract

The invention discloses a low dielectric constant glass fiber reinforced polyamide material and a preparation method thereof. The material is composed of the following components in parts by weight: 10-70 parts of PA66; 5-20 parts of PA6I / 6T copolymer; glass fiber 20-60 parts; 5-10 parts of zeolite; 0.8-1.2 parts of antioxidant; 0.5-1 part of lubricant; the preparation method is: mix the dried PA66, PA6I / 6T, zeolite, antioxidant and lubricant Finally, it is fed into the twin-screw extruder from the main feeding port, and the glass fiber treated with the silane coupling agent is fed into the twin-screw extruder through the side feeding port, and is melted, extruded, and granulated to obtain low dielectric constant glass fiber Reinforced polyamide material. The polyamide material prepared by the invention has low dielectric constant and low loss factor, excellent mechanical properties, excellent fluidity and excellent anti-floating fiber effect.

Description

technical field [0001] The invention relates to the technical field of polyamide materials, in particular to a low dielectric constant glass fiber reinforced polyamide material and a preparation method thereof. Background technique [0002] Engineering plastics usually have excellent mechanical strength, high temperature resistance, corrosion resistance, abrasion resistance, and are easy to process. They often replace metals in the manufacture of mechanical parts. Thermoplastic engineering materials include polyamide, polytetrafluoroethylene, ABS plastic, polyoxymethylene, and polycarbonate materials, which are widely used in electrical and electronic, automobile, construction, office equipment, machinery, aerospace and other industries. In recent years, it has become a popular trend to use engineering plastics to manufacture industrial parts and equipment casings. [0003] Thermoplastic polymer polyamide, commonly known as nylon, has excellent mechanical properties, high s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L77/06C08K13/06C08K9/06C08K7/14C08K7/26C08K5/526C08K5/20C08J5/08B29B9/06
Inventor 俞建刘亮李荣群姚为忠
Owner ORINKO NEW MATERIAL CO LTD