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Preparation method of thermistor copper electrode

A thermistor and copper electrode technology, which is applied in the field of preparation of thermistor copper electrodes, can solve problems such as metal deposition, achieve the effects of reducing raw material costs, saving labor costs, and avoiding metal deposition

Inactive Publication Date: 2018-01-19
JIANGSU SHIRUI ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the problem of metal deposition on other surfaces except the electrode covering surface during the electrode preparation process. For this reason, the present invention provides a method for preparing a thermistor copper electrode. Wax method, which can protect the surface of the substrate that does not need to be coated with electrodes to prevent the occurrence of metal deposition

Method used

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  • Preparation method of thermistor copper electrode
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  • Preparation method of thermistor copper electrode

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preparation example Construction

[0021] A method for preparing a thermistor copper electrode, the preparation method being a glue-dipping method. Combined with the following

[0022] Embodiment further elaborates the present invention.

Embodiment 1

[0024] 1. Etching, cleaning and drying the semiconductor thermistor ceramic substrate:

[0025] First, the ceramic substrate was etched with 5% HF solution for 5 minutes, then rinsed with deionized water, ultrasonically cleaned with hydrochloric acid solution and ammonia solution for 10 minutes, finally cleaned with deionized water, and dried in a 100°C drying oven for 30 minutes.

[0026] 2. Preparation of water-based sol:

[0027] Take a 500ml beaker, pour 10g of hexyl orthosilicate (TEOS) and 50ml of absolute ethanol together, then slowly add 200ml of deionized water, and finally add 0.8ml of 0.1mol / L HCl, stir well and then stand still for 30min to obtain Silica sol.

[0028] 3. Use a 200-250-mesh screen printing machine to screen-print the above-mentioned silica sol on the front and back of the substrate to be dipped. A sol layer is formed on the front and back of the substrate.

[0029] 4. Partially immerse the ceramic substrate with the sol layer in the wax dipping t...

Embodiment 2

[0038] 1. Etching, cleaning and drying the semiconductor thermistor ceramic substrate:

[0039] The method of Example 1 was used to process the ceramic substrate.

[0040] 2. Preparation of water-based sol:

[0041] Configure 10g of yttrium nitrate into a 50ml saturated solution, pour it into a 500ml beaker and carry out an ice bath for 15min, add 10ml of stearic acid surfactant to the beaker, mix well and continue the ice bath for 30min, then add 150ml of concentrated ammonia water to the beaker, A transparent sol was formed quickly, and then 100ml of deionized water was added.

[0042] The above-mentioned transparent sol was quickly put into an electrodialyzer to remove ions, and then ultrasonicated 3 times on an ultrasonic instrument (with a power of 1200W and each ultrasonic time of 3s) to obtain a transparent and stable yttrium sol.

[0043] 3. Use a 200-250-mesh screen printing machine to screen-print the above-mentioned yttrium sol on the front and back of the substra...

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Abstract

The invention discloses a preparation method of a thermistor copper electrode. The preparation method is a gluing and waxing method and comprises steps as follows: a ceramic matrix is cleaned and dried; water-borne sol is prepared; the water-borne sol is subjected to silk-screen printing on the surface of an electrode, requiring immersion plating, of the ceramic matrix; the side surface of an electrode, not requiring immersion plating, of the ceramic matrix is coated with a protective wax layer; the water-borne sol is washed away with water; the ceramic matrix is sequentially put in a nickel plating solution and a copper plating solution, the surface with no protective wax layer coated is coated with a nickel-based medium, and the copper electrode is subjected to chemical immersion plating; the ceramic matrix is put in a baking oven, the protective wax layer is removed through high-temperature baking, the ceramic matrix is cooled to the room temperature, and the thermistor copper electrode is prepared. According to the method, Cu is used to replace Ag to serve as an electrode material, the cost of raw materials is effectively reduced, and the prepared electrode is detected to havethe equivalent electrical performance of an Ag electrode. With the adoption of the gluing and waxing method, the metal deposition phenomenon can be effectively avoided, and the labor cost is saved.

Description

technical field [0001] The invention belongs to the field of electrode preparation, and in particular relates to a method for preparing a thermistor copper electrode. The preparation method is a glue-dipping method. Background technique [0002] Thermistors are a type of sensitive components, which are divided into positive temperature coefficient thermistors (PTC) and negative temperature coefficient thermistors (NTC) according to different temperature coefficients. A typical feature of a thermistor is that it is sensitive to temperature and exhibits different resistance values ​​at different temperatures. The positive temperature coefficient thermistor (PTC) has a larger resistance value when the temperature is higher, and the negative temperature coefficient thermistor (NTC) has a lower resistance value when the temperature is higher. They both belong to semiconductor devices. Traditional thermistor chip electrodes generally use screen printing silver paste and then sint...

Claims

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Application Information

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IPC IPC(8): C04B41/90
Inventor 汪洋吕立勇
Owner JIANGSU SHIRUI ELECTRONICS CO LTD