Manufacturing method of display panel, display panel and display device
A technology for display panels and substrates, which is applied to instruments, organic semiconductor devices, semiconductor devices, etc., can solve the problems of high resistance and low voltage uniformity, and achieve the effect of reducing resistance, high uniformity, and high uniformity.
Active Publication Date: 2020-11-20
BOE TECH GRP CO LTD +1
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- Application Information
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Problems solved by technology
[0005] Embodiments of the present invention provide a method for manufacturing a display panel, a display panel, and a display device, which can solve the problem of bridging through the transparent conductive pattern in the related art because the resistance of the transparent conductive material constituting the transparent conductive pattern is usually large. The problem of low uniformity of voltage across the common electrode pattern
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[0047] In order to make the object, technical solution and advantages of the present invention clearer, the implementation manner of the present invention will be further described in detail below in conjunction with the accompanying drawings.
[0048] The method for manufacturing a display panel provided by the embodiments of the present invention can be applied to manufacture a liquid crystal display panel (English: Liquid Crystal Display; LCD for short) or an organic light-emitting diode (English: Organic Light-Emitting Diode; OLED for short) display panel. The thin film transistor (English: Thin Film Transistor; abbreviation: TFT) in the display panel applied in the embodiment of the present invention may be an indium gallium zinc oxide (English: indium gallium zinc oxide; abbreviation: IGZO) TFT, and the current-carrying transistor of the IGZO TFT The sub-mobility is high, which can greatly increase the charge and discharge rate of the TFT to the pixel electrode, improve t...
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The invention discloses a manufacturing method of a display panel, a display panel and a display device, belonging to the field of display technology. The method includes: forming a plurality of gate lines and common electrode patterns on a base substrate; forming an insulating layer on the base substrate formed with a plurality of gate lines and common electrode patterns; forming via holes on the insulating layer; A metal conductive pattern is formed on the base substrate of the layer. The present invention electrically connects the common electrode patterns located on both sides of the grid line through the bridging structure in the conductive layer made of metal, reduces the resistance of the bridging structure, and then makes the common electrode that is bridging through the bridging pattern The uniformity of the voltage across the pattern is high. It solves the problem in the related art that because the resistance of the transparent conductive material constituting the transparent conductive pattern is generally high, this makes the uniformity of the voltage across the common electrode pattern bridged by the transparent conductive pattern low. The effect of high uniformity of the voltage across the common electrode pattern is achieved.
Description
technical field [0001] The present invention relates to the field of display technology, in particular to a method for manufacturing a display panel, a display panel and a display device. Background technique [0002] A base substrate in a display panel is usually provided with a plurality of gate lines, and a common electrode pattern for providing a stable and uniform voltage is provided on the same layer as the plurality of gate lines. The common electrode pattern is located in a plurality of regions divided by a plurality of gate lines. [0003] In the related art, in the process of manufacturing a display panel, an insulating layer including via holes is formed on the base substrate on which gate lines and common electrode patterns are formed, and then a transparent conductive pattern including a bridge structure is formed on the insulating layer. The jumper structure can connect the common electrode patterns located on both sides of the gate line through the via holes ...
Claims
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IPC IPC(8): H01L27/12
CPCH01L27/1222H01L27/124H01L27/1259H01L27/1225H01L27/1244H01L29/7869G02F1/136286H10K59/1213H10K59/1315H10K2102/341H10K71/861H01L27/1296H01L29/24G02F2201/123G02F1/1368G02F2201/121G02F1/133345
Inventor 任兴凤刘国全陈正伟
Owner BOE TECH GRP CO LTD