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Preparation method of organic silicon nano protective coating of modulation structure

A kind of protective coating and nano-coating technology, applied in coating, metal material coating process, gaseous chemical plating and other directions, can solve the problems of single performance, heat dissipation, signal transmission and other performance degradation, to reduce stress, The effect of improving toughness

Active Publication Date: 2018-02-13
JIANGSU FAVORED NANOTECHNOLOGY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0016] At present, for single-structure or single-component coatings, the performance is relatively single. To improve its protective performance, the thickness must be increased, and increasing the thickness will lead to performance degradation such as heat dissipation and signal transmission.

Method used

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  • Preparation method of organic silicon nano protective coating of modulation structure
  • Preparation method of organic silicon nano protective coating of modulation structure
  • Preparation method of organic silicon nano protective coating of modulation structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0084] A preparation method of an organosilicon nano protective coating with a modulated structure, comprising the following steps:

[0085] (1) Pre-processing:

[0086] Place the substrate in the reaction chamber of the nano-coating preparation equipment, close the reaction chamber and continuously evacuate the reaction chamber, pump the vacuum in the reaction chamber to 10 mTorr, pass in the inert gas Ar, and open the movement mechanism , causing the substrate to move in the reaction chamber;

[0087] In step (1), the base material is a solid material, and the solid material is a block aluminum material and a PCB board, and any interface of the base material surface can be exposed to cold and heat after the cold and heat cycle impact coating is prepared. in a loop test environment.

[0088] In the step (1), the reaction chamber is a rotating chamber, the volume of the reaction chamber is 50 L, the temperature of the reaction chamber is controlled at 30° C., and the flow ra...

Embodiment 2

[0110] A preparation method of an organosilicon nano protective coating with a modulated structure, comprising the following steps:

[0111] (1) Pretreatment

[0112] Place the substrate in the reaction chamber of the nano-coating preparation equipment, close the reaction chamber and continuously evacuate the reaction chamber, evacuate the vacuum in the reaction chamber to 60 millitorr, feed inert gas He, start the movement mechanism, move the substrate;

[0113] In step (1), the base material is a solid material, and the solid material is a block aluminum material, and any interface of the base material can be exposed to a damp heat test environment after the wet heat-resistant alternating coating is prepared on the surface of the base material.

[0114] The volume of the reaction chamber in step (1) is 280 L, the temperature of the reaction chamber is controlled at 40° C., and the flow rate of the inert gas is 15 sccm.

[0115] In step (1), the base material performs plane...

Embodiment 3

[0136] A preparation method of an organosilicon nano protective coating with a modulated structure, comprising the following steps:

[0137] (1) Pretreatment

[0138]Place the substrate in the reaction chamber of the nano-coating preparation equipment, close the reaction chamber and continuously evacuate the reaction chamber, evacuate the vacuum in the reaction chamber to 120 millitorr, pass in the inert gas Ar, start the movement mechanism, move the substrate;

[0139] In step (1), the base material is a solid material, and the solid material is a block polytetrafluoroethylene plate and an electrical component, and any interface of the block polytetrafluoroethylene plate can be exposed after the anti-mold coating is prepared on the surface Used in the GJB150.10A-2009 mold test environment, any interface of the electrical components can be exposed to the environment described in the international industrial waterproof grade standard IPX7 after the waterproof and electric brea...

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Abstract

The invention provides a preparation method of an organic silicon nano protective coating of a modulation structure and belongs to the technical field of plasmas. In the method, a reaction chamber isvacuumized, inert gas is led into the reaction chamber to enable a base material to move, preparation of an organic silicon coating and preparation of an organic fluorocarbon coating are alternately conducted, and thus the organic silicon-fluorocarbon multi-layer compact modulation structure is formed. Organic silicon monomer steam comprises the components of at least one type of organic silicon monomers comprising the structures containing double bonds, Si-Cl, Si-O-C, Si-N-Si and Si-O-Si or a ring-shaped structure and at least one type of mixtures of unsaturated hydrocarbon with polyfunctionality and hydrocarbon derivatives. According to the formed organic silicon-fluorocarbon multi-layer compact modulation structure, coating stress can be reduced, and the toughness of the coating is improved; meanwhile a transverse interface exists between organic silicon-fluorocarbon, a corrosion medium runs up against the transverse interface in the coating corrosion process and then corrosion transversely develops, so that longitudinal corrosion penetrating through the coating is not prone to being formed, and the situation that the corrosion medium penetrates through the coating to corrode protected materials and devices is avoided.

Description

technical field [0001] The invention belongs to the technical field of plasma chemical vapor deposition, and in particular relates to a preparation method of an organosilicon nano protective coating. Background technique [0002] Anti-mold, anti-humidity, and anti-salt mist (referred to as three antis) are important problems that need to be solved during the storage, transportation and use of electronic devices. Mold, salt spray and humidity often cause electronic devices to fail due to short circuits. [0003] At present, the use of protective coatings to protect electronic products is an effective way to improve the service life of electronic products. There are generally two methods for obtaining protective coatings, liquid phase and gas phase. The liquid phase method usually uses conformal paint. After coating the electronic products, it is cured by heat or light to form a dense organic coating on the circuit board to protect the circuit board and its related equipment...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C16/517C23C16/56
CPCC23C16/517C23C16/56
Inventor 宗坚
Owner JIANGSU FAVORED NANOTECHNOLOGY CO LTD
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