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Preparation method and device of composite metal sphere

A technology of composite metal and metal pellets, applied in metal processing equipment, metal material coating process, transportation and packaging, etc., can solve the problems of unfriendly environment, low efficiency, limited thickness of coating layer, etc., to solve the problem of low efficiency Effect

Inactive Publication Date: 2018-02-16
张家港创博金属科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The electroless plating method has the following disadvantages: 1) the environment is not friendly; 2) the efficiency is low; 3) the coating thickness is limited

Method used

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  • Preparation method and device of composite metal sphere

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] Preparation of copper-tin composite metal pellets.

[0041] The original balls are copper balls with a size of 200-300 microns;

[0042] The preparation device is attached figure 1 shown. The atomized metal is tin. Tin wire is used as the raw material of the atomized metal generator. The temperature in the vacuum chamber is controlled at 220-240°C, and the vacuum degree is controlled at 10 -2 the following. The vacuum chamber is filled with argon gas protection.

[0043] The rotation speed of the turntable is 50-500r / s, the diameter of the turntable is 20-800mm, the temperature of the metal tin solution is 225-235°C, and the depth of the solution is 500-1500mm. The rotation gradually slides to the edge, and as the centrifugal force continues to increase, the rolling speed increases continuously. When leaving the turntable, the speed is 100-600m / s.

[0044] The electromagnetic induction heating speed is 200-800°C / s.

[0045] The size of the produced pellets was b...

Embodiment 2

[0047] Preparation of copper-tin composite metal pellets.

[0048] The original balls are copper balls with a size of 100-150 microns;

[0049] The preparation device is attached figure 1 shown. The atomized metal is tin. Tin wire is used as the raw material of the atomized metal generator. The temperature in the vacuum chamber is controlled at 225-235°C, and the vacuum degree is controlled at 10 -3 the following. The vacuum chamber is filled with argon gas protection.

[0050] The rotation speed of the turntable is 100-400r / s, the diameter of the turntable is 50-600mm, the temperature of the metal tin solution is 225-235°C, and the depth of the solution is 300-500mm. The rotation gradually slides to the edge, and as the centrifugal force continues to increase, the rolling speed continues to increase. When leaving the turntable, the speed is 180-450m / s.

[0051] The electromagnetic induction heating rate is 160-400°C / s.

[0052] The size of the produced pellets was bet...

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Abstract

The invention relates to a preparation method and device of a composite metal sphere. A mother sphere penetrates an atomized droplet area to fall onto a rotary disc covering a metal solution to be thrown out by centrifugal force, then the mother sphere enters an electromagnetic induction coil for surface local melting and spheroidizing treatment, and the composite metal sphere high in sphericity degree is obtained. The method is suitable for preparing the composite sphere with the melting point of an outer metal layer lower than that of mother sphere metal.

Description

technical field [0001] The invention relates to a method and a device for preparing metal pellets, belonging to the technical field of powder metallurgy, in particular to a method and a device for preparing composite metal pellets. Background technique [0002] Integrated circuit boards have developed rapidly with the rapid development of the electronics industry. With the continuous improvement of miniaturization, flexibility and computing speed, the size and volume of integrated circuit boards and related electronic components are becoming smaller and thinner. This places increasingly stringent requirements on components and manufacturing processes. [0003] Metal balls and soldering technology are important materials and methods for connecting integrated circuit substrates and related components, especially solder balls with a size between 200-600 microns occupy an important position in the circuit board manufacturing process. With the diversification of circuit design ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F1/02B22F9/10C23C4/123C23C4/08
CPCC23C4/08C23C4/123B22F9/10B22F1/17
Inventor 李晶
Owner 张家港创博金属科技有限公司