Welding method for improving sufficient ground connection and heat dissipation of chip

Abstract

The invention discloses a welding method for improving sufficient ground connection and heat dissipation of a chip. The welding method is characterized by comprising the following steps: step SS1, preparing solder balls; step SS2, filling the solder balls in the step SS1 into bonding pad ground connection holes in a chip bonding pad on a circuit board; and step SS3, heating so that the solder balls in the bonding pad ground connection holes in the step SS2 are melted. Compared with the prior art, the working procedures of filling the solder balls into the bonding pad ground connection holes one by one and then putting the solder balls on a heating platform to be heated so that the solder balls in the bonding pad ground connection holes are melted are added, so that the bonding pad ground connection holes are filled with soldering tin to realize sufficient ground connection with the ground of the chip, sufficient heat dissipation of the chip is guaranteed, and the welding quality of thechip is improved.

Description

technical field [0001] The invention relates to a welding method for improving sufficient grounding and heat dissipation of chips, and belongs to the technical field of component welding. Background technique [0002] With the development of microelectronics technology, the integration of chips is getting higher and higher. The emergence of high-power integrated chips makes the requirements for chip welding process higher and higher. Especially for high-power chips, it needs to be fully grounded and dissipated to ensure The chip works normally. In the existing process, solder paste is applied to the pad area of ​​the chip to be soldered on the circuit board. It is found that after the solder paste melts, the solder does not flow into the chip to be soldered on the circuit board due to poor fluidity. In the ground hole of the pad, the solder in the ground hole is not full, and even some ground holes basically have no solder, which makes the chip not fully grounded during sol...

AI Technical Summary

Problems solved by technology

In the existing process, solder paste is applied to the pad area of ​​the chip to be soldered on the circuit board. It is found that after the solder paste melts, the solder does not flow into the chip to be soldered on the circuit board due to poor fluidity. In the ground hole of the pad, the solder in the ground hole is not full, and even there is basically no solder in some ground holes, which makes the chip not fully grounded during soldering, and the heat dissipation of the chip is not good

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