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Welding method for improving sufficient ground connection and heat dissipation of chip

A welding method and chip pad technology, which is applied in the field of component welding, can solve problems such as poor heat dissipation of the chip, insufficient soldering tin of the ground hole, insufficient flow of soldering tin, etc., to achieve the effect of ensuring sufficient heat dissipation and improving welding quality

Inactive Publication Date: 2018-02-16
HUADONG PHOTOELECTRIC TECHN INST OF ANHUI PROVINCE
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In the existing process, solder paste is applied to the pad area of ​​the chip to be soldered on the circuit board. It is found that after the solder paste melts, the solder does not flow into the chip to be soldered on the circuit board due to poor fluidity. In the ground hole of the pad, the solder in the ground hole is not full, and even there is basically no solder in some ground holes, which makes the chip not fully grounded during soldering, and the heat dissipation of the chip is not good

Method used

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  • Welding method for improving sufficient ground connection and heat dissipation of chip
  • Welding method for improving sufficient ground connection and heat dissipation of chip

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Embodiment Construction

[0017] The present invention will be further described below in conjunction with the accompanying drawings. The following examples are only used to illustrate the technical solution of the present invention more clearly, but not to limit the protection scope of the present invention.

[0018] figure 1 It is a flow chart of the method of the present invention. figure 2 is a structural schematic diagram of an operational embodiment of the present invention.

[0019] The present invention proposes a welding method for improving chip grounding and heat dissipation, which is characterized in that it comprises the following steps:

[0020] Step SS1: preparing solder balls 3 as required;

[0021] Step SS2: filling the solder ball 3 in the step SS1 into the pad ground hole 2 of the chip pad 1 on the circuit board;

[0022] Step SS3: heating to melt the solder balls 3 in the pad ground holes 2 in the step SS2.

[0023] As a preferred embodiment, the step SS1 specifically includes...

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Abstract

The invention discloses a welding method for improving sufficient ground connection and heat dissipation of a chip. The welding method is characterized by comprising the following steps: step SS1, preparing solder balls; step SS2, filling the solder balls in the step SS1 into bonding pad ground connection holes in a chip bonding pad on a circuit board; and step SS3, heating so that the solder balls in the bonding pad ground connection holes in the step SS2 are melted. Compared with the prior art, the working procedures of filling the solder balls into the bonding pad ground connection holes one by one and then putting the solder balls on a heating platform to be heated so that the solder balls in the bonding pad ground connection holes are melted are added, so that the bonding pad ground connection holes are filled with soldering tin to realize sufficient ground connection with the ground of the chip, sufficient heat dissipation of the chip is guaranteed, and the welding quality of thechip is improved.

Description

technical field [0001] The invention relates to a welding method for improving sufficient grounding and heat dissipation of chips, and belongs to the technical field of component welding. Background technique [0002] With the development of microelectronics technology, the integration of chips is getting higher and higher. The emergence of high-power integrated chips makes the requirements for chip welding process higher and higher. Especially for high-power chips, it needs to be fully grounded and dissipated to ensure The chip works normally. In the existing process, solder paste is applied to the pad area of ​​the chip to be soldered on the circuit board. It is found that after the solder paste melts, the solder does not flow into the chip to be soldered on the circuit board due to poor fluidity. In the ground hole of the pad, the solder in the ground hole is not full, and even some ground holes basically have no solder, which makes the chip not fully grounded during sol...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34
CPCH05K3/3457H05K2203/04
Inventor 汪宁费文军陈兴盛李金晶孟庆贤俞昌忠方航张庆燕李小亮
Owner HUADONG PHOTOELECTRIC TECHN INST OF ANHUI PROVINCE
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