Preparation method of rear surface silicon nitride multilayer film of PERC (passivated emitter rear cell)
A technology of silicon nitride film and silicon nitride coating, which is applied in the manufacture of circuits, electrical components, and final products to achieve the effects of improving light absorption, increasing reflectivity, and improving efficiency
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Embodiment 1
[0016] Such as figure 1 As shown, it is Example 1 of the present invention, a method for preparing a silicon nitride multilayer film on the back of a PERC battery. The back of the silicon wafer of the battery is subjected to texturing, diffusion, phosphorus washing, rear passivation deposition, annealing, and the back of the battery. Silicon nitride film coating, silicon nitride coating on the front of the battery, laser and printing sintering, silicon nitride coating on the back of the battery adopts double-layer silicon nitride coating, and the n value of the second layer of silicon nitride film is greater than that of the first layer of silicon nitride The n-value of the membrane.
[0017] The specific double-layer membrane is as follows:
[0018] The thickness of the first silicon nitride film is 50-100nm, the n value is 2.0-2.03, and SiH 4 400~800sccm (cubic centimeters per minute), NH 3 6000-10000sccm (cubic centimeters per minute), pressure 1700mtorr (millitorr), rad...
Embodiment 2
[0026] Embodiment 2 of the present invention, a method for preparing a silicon nitride multilayer film on the back of a PERC battery, which sequentially performs texturing, diffusion, phosphorus washing, rear passivation deposition, annealing, and silicon nitride plating on the back of the battery silicon wafer Silicon nitride coating on the front of the battery, laser and printing sintering, the silicon nitride coating on the back of the battery adopts three layers of silicon nitride coating,
[0027] The specific three-layer film is as follows:
[0028] The thickness of the first silicon nitride film is 50-100nm, the n value is 2.0-2.03, and SiH 4 400~800sccm (cubic centimeters per minute), NH 3 6000-10000sccm (cubic centimeters per minute), pressure 1700mtorr (millitorr), radio frequency power 5000-9000 watts.
[0029] The thickness of the second layer of silicon nitride film is 50-100nm, the n value is 2.20-2.30, using SiH 4 800~1200sccm, NH 3 3000~6000sccm, pressure ...
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