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Integrated circuit package intelligentized tool structure

A technology of integrated circuits and tooling, which is applied in the field of intelligent chemical tooling structure, can solve the problems of low intelligence, low packaging tooling automation, and large labor demand, and achieve the effect of reducing labor costs, eliminating the risk of manual identification errors, and comprehensive cleaning

Pending Publication Date: 2018-02-27
WUXI LINLI SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to solve the technical problems of the existing integrated circuit packaging tooling with low automation, low intelligence and large labor demand

Method used

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  • Integrated circuit package intelligentized tool structure
  • Integrated circuit package intelligentized tool structure
  • Integrated circuit package intelligentized tool structure

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Embodiment Construction

[0013] The specific implementation manners of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0014] like figure 1 , figure 2 and image 3 As shown, the integrated circuit packaging intelligent tooling structure of the present invention includes a tooling body 5, which includes four side plates surrounded by a rectangle, wherein the inner surfaces of the two opposite side plates are provided with matching grooves 9 for placing Object, the outer surface of one side plate of the tooling body is provided with a group of positioning structures, the positioning structure is used to cooperate with external equipment to position the tooling body, and the positioning mechanism includes two circular positioning holes 6 and a triangular positioning hole 4. When the tooling reaches the designated position, its positioning hole matches the positioning pin on the external equipment, so as to locate the initial position of the too...

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Abstract

The invention discloses an integrated circuit package intelligentized tool structure which comprises a tool body which comprises four side plates forming a rectangle. Matched grooves are formed in theinner surfaces of two opposite side plates, a set of positioning structures are arranged on the outer surface of the tool body, an RF recognition sensing module, an online recognition bar code and astarting point are arranged on the outer surfaces of the side plates, the side plates are further provided with a plurality of plasma cleaning runners for cleaning objects inside the tool body, and the cleaning runners correspond to the grooves one to one. Due to intelligent remote control RF recognition sensing, the risk of wrong artificial recognition in the production process is eradicated; dueto the sensing recognition and positioning structure and the tool positioning and robot grabbing structure, production automation can be achieved; due to the plasma cleaning runner structural design,the cleaning effect inside the tool of the structure can be effectively enhanced, and the structure is more comprehensively cleaned.

Description

technical field [0001] The invention relates to the technical field of integrated circuit packaging, in particular to an intelligent chemical packaging structure. Background technique [0002] Most of the existing integrated circuit packaging tooling is a clip structure, such as figure 1 As shown, it mainly includes a frame surrounded by four side panels. There are multiple grooves in the frame for loading objects. In the actual production process of semiconductor packaging, the clip tooling is used as the main transportation and turnover carrier for production, and participates in Most of the packaging production process, such as: full participation in the production of chip loading, wire bonding, and plastic packaging, currently the existing structure requires a lot of manpower to participate in production, such as: the initial positioning of the magazine requires manual positioning, and the information of the magazine is also paper qualitative information. In this case,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67121H01L21/67294
Inventor 付强刘桂芝马丙乾罗卫国段世峰
Owner WUXI LINLI SCI & TECH CO LTD
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