Integrated type passive wireless micro mechanical switch and preparation method therefor

Abstract

The invention discloses an integrated type passive wireless micro mechanical switch and a preparation method therefor. The micro mechanical switch takes a P type substrate 10 as the substrate, and isprovided with the P type substrate 10, an N well 11, a P well 12, an N+ doped region 13, a P+ doped region 14, a first insulating layer 15, a first metal layer 17, a second insulating layer 18 and a second metal layer 19 from the bottom up in sequence; and by virtue of a multi-step doping process, a film coating process, an electroplating process and a sacrificial layer technology, the integratedtype passive wireless micro mechanical switch structure which comprises a diode, a capacitor, a resistor, a micro mechanical switch and an inductor can be prepared on the same chip. Compared with assembling of a separated device, the area of the integrated system is greatly reduced, the length of an interconnection line is shortened, and system reliability is improved.

Description

technical field [0001] The invention relates to a preparation technology of an integrated passive wireless micromechanical switch, which belongs to the field of microelectronic technology. Background technique [0002] A switch is a device used to control the on and off of a signal. Traditional wireless switches generally use radio frequency transceivers to control the switch, and a battery is required in the switch unit to supply power to the transceiver circuit. Because of the battery, this wireless switch has a limited lifespan. Passive wireless switch means that the on-off of the switch is realized in a passive and wireless way. The work of the passive wireless switch requires neither connection nor power supply or batteries, so it can realize wireless control and long-life use. [0003] The integrated passive wireless micromechanical switch contains diode, capacitor, resistor, micromechanical switch and inductor structures. The traditional preparation method is to p...

AI Technical Summary

Problems solved by technology

The advantage of multi-chip assembly technology is that the complexity of a single chip is reduced, so its research and development costs are reduced. The performance of the sensor integrated system is difficult to break through

The second type is to directly integrate the multi-device structure on a wafer. This method can overcome many shortcomings of multi-chip assembly technology. Its advantages include system size reduction, interconnect length reduction, reliability improvement, and mass production cost. Reduced, etc., and its disadvantage will be that the difficulty of research and development will increase, so the cost of research and development will increase

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