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A kind of preparation method for the fluorescent film structure of LED

A thin-film structure and fluorescence technology, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of shortening the packaging process, fluorescent powder precipitation, and reducing production costs, so as to achieve reduced packaging process, convenient size, and simple preparation method Effect

Active Publication Date: 2019-07-26
NINGBO LONGER LIGHTING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The purpose of the present invention is to provide a fluorescent film structure for LED and its preparation method. The preparation method is simple and feasible, and can solve the reabsorption effect between different phosphor powders in the glue dispensing process, phosphor powder backscattering blue light, and LED heat dissipation ability. Poor, fluorescent powder precipitation phenomenon, and poor light color consistency in the packaging process. The heat dissipation ability of the upper surface of the LED is improved, the thermal aging and light decay of the phosphor powder are weakened, and the service life of the LED is improved. Moreover, the preparation method shortens the packaging process and reduces the production cost.

Method used

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  • A kind of preparation method for the fluorescent film structure of LED
  • A kind of preparation method for the fluorescent film structure of LED

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Embodiment 1

[0037] Weigh A, B silica gel, YAG (Y 3 al 5 o 12 : Ce) Phosphor powder 5g, 5g, 1.5g, that is, the proportion is A:B:YAG=1:1:0.3, it is fully mixed evenly, after the mixed fluorescent glue is degassed and vacuumized, it is placed in the feed The cylinder is spin-coated on the PET film placed on the glass substrate. The acceleration of the first stage of the homogenizer is: 340rpm / s, the speed of the second stage of the uniform stage is: 420rpm / s, and the third stage is the stop stage. Both acceleration and acceleration are 0rpm / s, and the spin coating time is 160s. Afterwards, it was cured in an oven at 80°C for 20 minutes, and then cured at 150°C for 10 minutes. On the basis of the first layer, spin coat another layer according to the above-mentioned ratio and method. The third layer is the boron nitride layer. Before coating, the boron nitride is ultrasonically oscillated for 30 minutes. The boron nitride is dispersed in isopropanol with a concentration of 2mg / ml. Weigh 5...

Embodiment 2

[0039] Weigh A, B silica gel, YAG (Y 3 al 5 o 12 : Ce) Phosphor powder 5g, 5g, 1.5g, that is, the proportion is A:B:YAG=1:1:0.3, it is fully mixed evenly, after the mixed fluorescent glue is degassed and vacuumized, it is placed in the feed The cylinder is spin-coated on the PET film placed on the glass substrate. The acceleration of the first stage of the homogenizer is: 340rpm / s, the speed of the second stage of the uniform stage is: 420rpm / s, and the third stage is the stop stage. Both acceleration and acceleration are 0rpm / s, and the spin coating time is 160s. Afterwards, it was cured in an oven at 80°C for 20 minutes, and then cured at 150°C for 10 minutes. The second layer is the boron nitride layer. Before use, the boron nitride is ultrasonically oscillated for 30 minutes. The boron nitride is dispersed in isopropanol with a concentration of 2mg / ml. Weigh 5g of silica gel A and B respectively, and Boron isopropanol dispersion 2.5ml, mixed well, placed in a vacuum de...

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Abstract

The invention relates to a preparation method of a fluorescent film structure of an LED. One or several kinds of fluorescent powder is fixed with a binding agent uniformly; after defoaming and vacuumizing, the materials are coated on a carrier on a substrate repeatedly by multiple layers and curing is carried out; the top layer, the intermediate layer or the bottom layer of the fluorescent film iscoated with graphene or boron nitride and curing is carried out after coating completion; and then a fluorescent film with the enhanced LED cooling capability is obtained by once forming and the filmis packaged to one or more blue-light chips to obtain a white-light LED. Therefore, problems of re-absorption between different fluorescent powders in the dispensing process, backscattering of blue light by the fluorescent powder, poor LED cooling capability, fluorescent powder precipitation, and poor light color consistency effect in the packaging process are solved; the packaging process is shortened; and the production cost is lowered.

Description

technical field [0001] The invention relates to a method for preparing a fluorescent film structure used for LEDs, which can improve the heat dissipation capacity of LEDs and belongs to the field of solid lighting. Background technique [0002] As a new type of solid light source, white light LED has attracted widespread attention due to its small size, long life, energy saving, environmental protection, and high light efficiency. It is considered as the third-generation lighting technology and is widely used in large-screen display, landscape lighting, and street lighting. , indoor lighting, traffic lights and other fields. [0003] At present, the packaging method of industrialized white LEDs is the combination of blue chips and yellow phosphors or green and red phosphors. The specific process is to fix the chips on the bracket, and weigh a certain proportion of phosphors and After the silicone or epoxy resin glue is fully mixed, put it in a vacuum defoaming machine for v...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/50H01L33/48H01L33/00
CPCH01L33/00H01L33/48H01L33/502
Inventor 邹军刘祎明石明明李杨杨波波李文博房永征
Owner NINGBO LONGER LIGHTING
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