Small vacuum three-target magnetron sputtering coating machine

A vacuum and magnetron technology, applied in the field of small vacuum magnetron three-target sputtering coating machine, to achieve the effect of protecting the safety of equipment

Inactive Publication Date: 2018-03-20
沈阳鹏程真空技术有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It is an ideal equipment for modern material science research, but the existing instruments and electrical controls are relatively simple, and manual operations are mostly used. Operators must undergo profess

Method used

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  • Small vacuum three-target magnetron sputtering coating machine
  • Small vacuum three-target magnetron sputtering coating machine
  • Small vacuum three-target magnetron sputtering coating machine

Examples

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Example Embodiment

[0019] Example

[0020] A small vacuum magnetron three-target sputtering plating machine, including a vacuum chamber 3, an upper cover of the vacuum chamber 2, three magnetron targets 1 evenly distributed on the upper cover 2, in order to offset the gravity when the upper cover 2 is opened , The upper cover 2 is connected with two pneumatic support rods 5, the front of the vacuum chamber 3 is provided with a glass observation window 4, the right side of the vacuum chamber 3 is provided with an auxiliary lighting interface 17, and the exhaust port at the rear of the vacuum chamber 2 is provided with a throttle Valve 13, changing the angle of the throttle valve 13 changes the size of the air flow into the molecular pump 11, which plays a role in adjusting the vacuum degree, and can also block a part of the sputtered substance from entering the molecular pump 11, thereby extending the molecular pump 11 Service life. The pumping port of the molecular pump 11 is connected to the pump...

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PUM

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Abstract

The invention discloses a small vacuum three-target magnetron sputtering coating machine, and relates to a coating machine. The coating machine comprises a vacuum chamber, a machine table, an electrical apparatus control system, an upper cover and three magnetron targets, wherein the machine table supports the vacuum chamber, the electrical apparatus control system and the upper cover of the vacuum chamber are arranged in the machine table, and the three magnetron targets are evenly distributed on the upper cover; the upper cover is connected with two air pressure supporting rods, a suction pipe is arranged behind the vacuum chamber, a throttle valve is arranged in the suction pipe, the rear end of the suction pipe is connected with a molecular pump through a pneumatic gate valve, and an exhaust opening of the molecular pump is connected with a mechanical pump through a corrugated pipe; the three magnetron targets are evenly distributed on the upper cover of the vacuum chamber, and anindependent baffle mechanism is arranged on each target head; a glass observation window is arranged in front of the vacuum chamber; and an introducing interface for auxiliary illuminating is formed in the right face of the vacuum chamber. The small vacuum three-target magnetron sputtering coating machine is of an integrated structure and can work by being externally connected with water, electricity and gas, and users only need to set a plurality of parameters such as the coating time and put samples and take samples so that the coating machine can operated fully automatically.

Description

technical field [0001] The invention relates to a vacuum plating equipment, in particular to a small vacuum magnetron three-target sputtering plating machine. Background technique [0002] The device based on the principle of magnetron sputtering technology (high-speed low-temperature sputtering) can prepare nano-scale single-layer and multi-layer functional films such as various hard films, metal films, semiconductor films, dielectric films, ferromagnetic films and magnetic films. Its characteristics are: all kinds of materials that can be prepared into targets can be used as thin film materials, including various metals, semiconductors, ferromagnetic materials, and insulating oxides, ceramics, polymers, etc., especially suitable for high melting point and low Vapor pressure material deposition coating. Co-sputtering with multi-component targets under appropriate conditions can deposit mixtures and compound films of required components; adding oxygen, nitrogen or other act...

Claims

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Application Information

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IPC IPC(8): C23C14/35C23C14/54
CPCC23C14/352C23C14/54
Inventor 李双江董顺曹崇友
Owner 沈阳鹏程真空技术有限责任公司
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