A thin carrier tape cover tape base paper and its manufacturing method

A manufacturing method and technology for covering tape, which are applied in papermaking, paper, textiles and papermaking, etc., can solve the problems of PET substrate and other materials delamination or glue leakage, volatile solvents pollute the environment, and adversely affect the health of operators, etc. High surface strength, improved transparency, effect of increasing transparency

Active Publication Date: 2020-08-14
浙江洁美电子信息材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Adhesives are required for bonding PET substrates to other materials, and adhesives need to be dissolved and diluted by volatile solvents, so the entire production process is not only cumbersome but also pollutes the environment with volatile solvents, which is not conducive to the health of operators. Uneven coating or too fast drying can easily cause delamination or glue leakage between PET substrates and other materials.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] A method for manufacturing base paper for a thin carrier tape cover tape, including processes such as pulp board disintegration, beating, batching, online forming, first drying section, surface sizing, second drying section, coiling, slitting and rewinding, etc. ; Concretely include the following steps:

[0034] (1) Mix bleached softwood pulp and bleached cotton pulp at a ratio of 50%:50% and send them to a medium or high consistency pulper for crushing. The pulping concentration is 8%. After crushing for 25 minutes, put it into the coarse pulp pool, then dilute the concentration to 3.8% with clean water, and then send it to the refiner for refining, and use the semi-free partial viscous beating method to properly cut and fully fine the pulp fibers until the beating degree is at 45 ° SR, wet Weighing 12g, the processed slurry is put into the slurry tank for use;

[0035] (2) Transfer the treated slurry in step (1) into the batching tank, and add 1.0% emulsion-type ther...

Embodiment 2

[0039] A method for manufacturing base paper for a thin carrier tape cover tape, including processes such as pulp board disintegration, beating, batching, online forming, first drying section, surface sizing, second drying section, coiling, slitting and rewinding, etc. ; Concretely include the following steps:

[0040] (1) Mix bleached softwood pulp and bleached cotton pulp at a ratio of 60%:40% and send them to a medium or high consistency pulper for crushing. The pulping concentration is 9%. After crushing for 25 minutes, put it into the coarse pulp pool, then dilute the concentration to 4.0% with clean water, and then send it to the refiner for pulping, and use the semi-free partial viscous beating method to properly cut and fully fine the pulp fibers until the beating degree is 55 ° SR, wet Weighing 13g, the treated slurry is put into the slurry tank for use;

[0041](2) Transfer the treated slurry in step (1) into the batching tank, and add 2.0% of emulsion-type thermose...

Embodiment 3

[0045] A method for manufacturing base paper for a thin carrier tape cover tape, including processes such as pulp board disintegration, beating, batching, online forming, first drying section, surface sizing, second drying section, coiling, slitting and rewinding, etc. ; Concretely include the following steps:

[0046] (1) Mix bleached softwood pulp and bleached cotton pulp at a ratio of 70%:30% and send them to a medium or high consistency pulper for crushing. The pulping concentration is 10%. After crushing for 25 minutes, put it into the coarse pulp pool, then dilute the concentration to 4.3% with clean water, and then send it to the refiner for refining, and use the semi-free viscous beating method to properly cut and fully fine the pulp fibers until the beating degree is 65°SR, wet Weighing 14g, the processed slurry is put into the slurry tank for use;

[0047] (2) Transfer the treated slurry in step (1) into the batching tank, and add 3.0% of emulsion-type thermosetting...

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PUM

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Abstract

The invention relates to the technical field of electronic element packaging, in particular to covering paper used through being matched with a thin type carry tape. The fixed quantity of the coveringtape raw paper is 25g / m<2> to 40g / m<2>; the longitudinal tensile strength is 2.5 KN / m to 4.5 KN / m; the ratio of the longitudinal tension to the transverse tension is (5:1) to (6:1), the D65 brightness is 78 to 85 percent; the transparency is 65 to 80 percent; the surface intensity is 22A; the water absorptivity is 13g / <2> to 18g / <2>; the moisture content is 5.0 to 7.0 percent. Through light-facing inspection, the paper fiber tissue arrangement is uniform; no cloud pattern fiber groups exist. The raw paper tensile strength is high; the transparency is high; the fiber shaping is firm; the surface intensity is high; during the cutting and end surface friction, hair falling and powder falling cannot occur; the raw paper is used as a substrate instead of a PET film; a hot sealing glue film isdirectly covered on the raw paper substrate; then, splitting processing is performed to obtain the thin type carry tape covering tape raw paper. The coating of adhesives, PE films, anti-static agentsand the like is not needed.

Description

technical field [0001] The invention relates to the technical field of packaging of electronic components, in particular to covering paper used in conjunction with thin carrier tapes. Background technique [0002] Thin carrier tape cover tape is mainly used for packaging thin carrier tapes for carrying chip electronic components, including punched paper carrier tapes, PS carrier tapes, PC carrier tapes, PS\PC carrier tapes, etc. According to the packaging requirements of electronic components, the thin carrier tape cover tape and its base paper should have high whiteness and transparency, so as to facilitate the observation of the arrangement of electronic components in the thin carrier tape; it should have good heat sealing performance and better performance. The loading hole of the thin carrier tape should have a high tensile strength so that the cover tape will not be broken when the cover tape is pulled up to access the electronic components. The thin carrier tape cover...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): D21H11/12D21H21/06D21H21/08D21H21/18D21H21/36D21H21/16D21H21/14
CPCD21H11/12D21H21/06D21H21/08D21H21/14D21H21/16D21H21/18D21H21/36
Inventor 姜兆宏孙忠诚
Owner 浙江洁美电子信息材料有限公司
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