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Tetrafunctional epoxy resin, and preparation method and application thereof

A technology of group epoxy resin and epoxy resin, applied in the field of tetrafunctional epoxy resin, can solve the problems of chemical leakage accident, difficult environmental management, and safety management, and achieves low equipment investment and low environmental management difficulty. , The effect of waste disposal is simple and easy

Active Publication Date: 2018-04-20
建滔电子材料(江阴)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] 2. Large equipment investment:
[0010] 3. High energy consumption:
[0012] 4. Safety management is difficult;
[0013] Long process routes, many equipments, many types of raw materials, many personnel allocations, and many production links are prone to equipment safety accidents, material safety accidents, personnel safety accidents, chemical leakage accidents, etc.
[0014] 5. Environmental protection management is difficult;
[0017] 1. The process route is short:

Method used

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  • Tetrafunctional epoxy resin, and preparation method and application thereof
  • Tetrafunctional epoxy resin, and preparation method and application thereof
  • Tetrafunctional epoxy resin, and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0061] Add 315g bisphenol A type epoxy resin to the round bottom flask equipped with electric stirring, reflux condenser, and thermometer, pass nitrogen protection, turn on the heating device to heat bisphenol A type epoxy resin to 100°C, add 35 g tetraphenol Diethyl ethane and 0.18g triphenylphosphine were dissolved for 10 minutes and started to stir. Start the vacuum pump to evacuate the air in the four-necked round-bottomed flask, keep it below -0.095Mpa for 10 minutes, and then blow nitrogen to break the vacuum. Turn on the heating device to raise the temperature to about 130-140°C, control the exothermic temperature of the reaction at 150-155°C for 120 minutes, add 160g of acetone after the reaction, and dissolve it into a finished product to obtain resin 1. Epoxy equivalent 238g / Eq G Chromaticity 13.9 Hydrolyzed chlorine 238ppm Solid content 69.65%

Embodiment 2

[0063] Repeat embodiment 1, wherein the amount of bisphenol A epoxy resin is 245g, and the amount of tetraphenol ethane is 105g and all the other are the same as embodiment 1.

Embodiment 3

[0065] Repeat embodiment 1, wherein the amount of bisphenol A epoxy resin is 280g, and the amount of tetraphenol ethane is 70g and all the other are the same as embodiment 1.

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Abstract

The invention relates to a novel tetrafunctional epoxy resin. The novel tetrafunctional epoxy resin has an ultraviolet light (UV) and fluorescence blocking function, and also has the advantages of short process route, small device investment, low energy consumption, low safety management difficulty and easy environmental protection based on the UV and fluorescence blocking function. The tetrafunctional epoxy resin can be compounded with any one or more epoxy resins to obtain epoxy resin with the UV and fluorescence blocking function, and also can be compounded with a curing agent to obtain a hardener.

Description

technical field [0001] The invention relates to a four-functional epoxy resin, its preparation method, and its application in blocking ultraviolet light and fluorescent properties. Background technique [0002] In today's information age, electronic appliances affect everyone's life, and with the development of the times, electronic appliances are constantly improving. Electronic appliances will inevitably put forward higher requirements for the PCB, which is an important part of it. The circuit density of the PCB has been greatly increased, and the processing technology of the circuit board has been greatly improved. In the past, the traditional process of screen printing thermal solder resistance film was difficult to meet. The increasingly sophisticated circuit requirements are gradually being replaced by the photosensitive solder resist process. The photosensitive solder resist is coated on both sides of the circuit board, and then exposed to ultraviolet light on both si...

Claims

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Application Information

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IPC IPC(8): C07D303/26C08L63/04C08L63/00C08G59/32
CPCC07D303/26C08G59/3218C08L63/04C08L2201/08C08L2205/02C08L63/00
Inventor 张久久陈儒周国荣高兴元
Owner 建滔电子材料(江阴)有限公司
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