Three dimensional integrated photon chip interlayer coupler

Abstract

The invention discloses an interlayer coupler adopting an evanescent wave coupling solution based on two dimensional grating refractive index regulation and control. The interlayer coupler is advantaged by wide bandwidth, high efficiency, compact design, good processing tolerance and the like; compared with a conventional three dimensional photon integrated chip interlayer coupler, an interlayer coupler employing a mode converter based on a counter-cone is advantaged by short coupling length, small device size and wide optical bandwidth; as for a common one dimensional grating-based mode of conducting refractive index regulation and control on a high refractive index waveguide, one dimensional gratings are small in feature size when a duty ratio is small, and stable processing is hard to realize in actual chip producing processes; via adoption of a two dimensional grating-based solution, duty ratio aggregation is realized, a feature size of a device can be increased, processing feasibility is increased, and advantages in actual chip producing processes can be strengthened.

Description

technical field [0001] The invention relates to the technical field of photonic integrated communication, and more specifically, relates to an interlayer coupler of a three-dimensional integrated photonic chip. Background technique [0002] In the development process of traditional photonic integrated chips, in order to reduce the cost of research and development and production, most of them adopt the CMOS planar processing technology of integrated circuits, and the photonic chips produced by processing are mostly planar single-layer structures. In recent years, with the development of photonic integrated chips, the scale and function of chips have been continuously increasing, and traditional two-dimensional photonic chips are gradually developing towards higher integrated three-dimensional integrated photonic chips. In the case of the same chip area, the three-dimensional waveguide layer stacking makes the chip more integrated and realizes more functions. At the same time...

AI Technical Summary

Problems solved by technology

This method is limited in use. On the one hand, the diffraction of light has strict requirements on the wavelength of light. On the other hand, the efficiency of diffraction is also limited, making it difficult to achieve high-efficiency interlayer coupling.

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