Coupled-packaged silicon photon chip

Abstract

The invention provides a coupled-packaged silicon photon chip comprising a substrate, a laser chip daughter board, a micro-optical module group, and a silicon photon chip. The laser chip daughter board and the micro-optical module group are respectively connected to the substrate. A groove for transmitting laser light is formed in one end, being close to the micro-optical module group, of the substrate. The laser chip daughter board is used for emitting a laser light wave; and the micro-optical module group is configured to convert the laser light wave into a TE wave and transmit the TE wave to the groove. The substrate is connected to the silicon photon chip; and an optical path coupling grating of the silicon photon chip is arranged at a TE wave transmission direction in the groove. Therefore, the back propagation of the interface light wave can be reduced to protect the laser chip; the low-loss coupling of the laser chip and the silicon photon chip is realized; the structure is compact and the size is small; the silicon-photon-wafer-level bonding packaging is realized; and the laser is outputted in a TE wave manner; and no mode converter needs to be manufactured on the silicon photonic wafer.

Description

technical field [0001] The invention relates to the field of optical technology, and more specifically, to a coupled and packaged silicon photonic chip. Background technique [0002] Silicon photonics technology refers to the fabrication of optical devices, photonic integrated circuits and optoelectronic integrated circuits on silicon-based materials to achieve signal transmission and processing. Silicon photonic devices have a wide range of uses and a large application span, from metropolitan area networks such as communications with a length of more than 1,000 kilometers, from optical access networks to LAN / storage networks, from device-level backplane interconnection to board-level chips Interconnects, even on-chip interconnects, have a wide range of applications. At present, silicon photonic chips can process data at a speed of 300Gbps per square millimeter, which is 10 times or even 50 times faster than existing standard processors. [0003] The basic elements of opti...

AI Technical Summary

Problems solved by technology

[0006] The present invention provides a coupled and packaged silicon photonic chip that overcomes the above-mentioned problems or at least partially solves the above-mentioned problems. High interconnection requirements, high cost, and low coupling efficiency

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