Double flexible pair-based three-degree-of-freedom precision adjustment parallel mechanism

Abstract

The invention relates to a double flexible pair-based three-degree-of-freedom precision adjustment parallel mechanism, comprising three groups of motion branch chains which are connected in parallel and have the same structure, wherein the three groups of motion branch chains are in uneven circumference distribution at three extending ends of an immersion unit by taking a center hole of the immersion unit as a center; each group of motion branch chain comprises a linear motion assembly, a double flexible pair connecting rod assembly, a mechanical anti-collision assembly, a Z-direction displacement measuring assembly and a gravity compensation assembly. The double flexible pair-based three-degree-of-freedom precision adjustment parallel mechanism is used for realizing installation, fixationand space position adjustment of the immersion unit of an immersion type photoetching machine and realizing micron-level positioning of the immersion unit; double flexible pairs are adopted, the structure is simple and compact, and the advantages of no friction and no need of lubrication are achieved; the wholly mechanism adopts a parallel mechanism, the rigidity is high, the response is quick, the adjustment range is large, modular design and assembly are adopted, and the mechanism can be used for three-degree-of-freedom precision adjustment in other occasions except the immersion type photoetching machine.

Description

technical field [0001] The invention relates to a three-degree-of-freedom precision-adjustment parallel mechanism, in particular to a three-degree-of-freedom precision-adjust parallel mechanism based on double flexible pairs. Background technique [0002] Immersion lithography machine is the core equipment of VLSI manufacturing. Different from the traditional lithography machine, the immersion lithography machine adds a layer of liquid between the projection objective lens and the silicon wafer, called the immersion flow field. This increases the refractive index, resulting in higher resolution. Immersion lithography is the only practical technology used in the current IC production line below 45nm. [0003] The immersion flow field is generated by the immersion unit, and in order to prevent the leakage of the immersion flow field, the gap between the immersion unit and the silicon wafer is required to be within 1 mm, and there is a strict parallelism requirement for the g...

AI Technical Summary

Problems solved by technology

At the same time, complex optical systems and corresponding supporting mechanisms must be combined in a limited space, so there are strict installation space restrictions for each component

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