The utility model discloses a SIP circuit board heat dissipation structure belongs to SIP circuit heat dissipation technical field, including heat dissipation subassembly, for the heat of SIP circuit generates transmission to the outside, shell, the shell is connected with heat dissipation subassembly and forms a sealed component, and SIP circuit board is encapsulated in the sealed component inside, heat dissipation subassembly includes: base plate, heat exchange seat and cooling
assembly, the top of base plate is used for installing the various elements of SIP circuit, and the bottom of base plate is connected with the top of heat exchange group, cooling
assembly is connected with the bottom of heat exchange seat, the shell is encapsulated in the top of heat exchange seat, and SIP circuit board is encapsulated in the inside, through the base plate, heat exchange seat and the cooling
assembly of liquid cooling mode of setting, three cooperation can quickly pass SIP circuit board
electrical element's temperature to the outside, and the installation space of
electrical element is not affected, thereby under the prerequisite of guaranteeing installation space, can quickly cool down.