Packaging structure for packaging OLED device, and display device

Abstract

The invention discloses a packaging structure for packaging an OLED device. The packaging structure comprises a packaging unit. The packaging unit comprises an optical adhesive layer; an inorganic packaging layer arranged on the optical adhesive layer; and an organic packaging layer arranged on the inorganic packaging layer. According to the invention, the optical adhesive layer is introduced intothe packaging structure. The stress strain of the inorganic packaging layer during bending is reduced, so that the cracking risk of the inorganic packaging layer is reduced. In addition, compared with the prior art, the packaging structure provided by the invention saves a barrier layer on the outermost layer of the structure. Therefore, the thickness of the packaging structure can be reduced, and the equipment thinning development can be facilitated.

Description

technical field [0001] The invention belongs to the technical field of organic light-emitting display, and in particular relates to a packaging structure for packaging OLED devices and a display device. Background technique [0002] In recent years, organic light-emitting diode (Organic Light-Emitting Diode, OLED) display device has become a very popular emerging flat-panel display device product at home and abroad, because OLED display device has self-illumination, wide viewing angle, short response time, high luminous efficiency, It has the characteristics of wide color gamut, low operating voltage, thin thickness, large-size and flexible panels and simple manufacturing process, and it also has the potential of low cost. [0003] In the manufacturing process of OLED devices, metal electrodes and organic light-emitting layers are very sensitive to water vapor and oxygen. Oxygen will oxidize the metal electrodes, and water vapor will cause oxidation and crystallization of th...

AI Technical Summary

Problems solved by technology

like figure 2 as shown, figure 1 The range of the stress-strain Axial Strain of the package structure shown is between -2.5 and 2.5, the maximum value reaches 2.5 and the minimum value reaches -2.5, and there is only one position where the stress-strain Axial Strain is 0, that is, the position of the central layer. The inorganic encapsulation layers 11 and 13 in such an encapsulation structure are prone to cracks during the bending process, thereby losing the encapsulation effect.

In addition, the thickness of the barrier layer 14 is generally between tens of microns and hundreds of microns, which also increases the thickness of the entire OLED device.

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