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High-temperature-resistant solder resist ink and circuit thereof

A technology of high temperature resistant, solder resist ink, applied in the direction of ink, printed circuit, printed circuit manufacturing, etc., can solve the problems of difficult to achieve application, low ink viscosity, flying ink and so on

Active Publication Date: 2018-05-08
深圳市容大感光科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The main problem is that the ink will fly during the printing process, that is to say, the ink will fly to the non-printing area in a very small amount, so that the inkjet printing process cannot be used in the production of printed circuits.
Another problem is the low viscosity and low surface tension of the ink. The ink is easy to spread when printed on the metal copper wire and the substrate, which reduces the resolution and is difficult to achieve the purpose of application.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example 1

[0033] In a three-necked flask equipped with a stirring and heating device, add 200 grams of pentaerythritol triacrylate (hydroxyl value 117), 0.1 gram of p-methoxyphenol, and 0.4 grams of triphenylphosphine, heat while stirring, and the temperature rises to 90 ° C At this time, add 50 grams of phthalic anhydride, continue to heat up to 110°C, react for three hours, measure the acid value to 77, and cool to below 60°C. Resin A was obtained as a pale yellow viscous liquid.

preparation example 2

[0035] In a three-necked flask equipped with a stirring and heating device, add 200 grams of pentaerythritol triacrylate (hydroxyl value 117), 0.1 gram of p-methoxyphenol, and 0.4 grams of triphenylphosphine, heat while stirring, and the temperature rises to 90 ° C At this time, 52 grams of tetrahydrophthalic anhydride was added, and the temperature was continued to rise to 110° C., and the reaction was carried out for three hours. The acid value was measured to be 78, and cooled to below 60° C. Resin B was obtained as a pale yellow viscous liquid.

preparation example 3

[0037] In a three-necked flask equipped with a stirring and heating device, add 284 grams of glycidyl methacrylate (2 equivalents), 0.1 gram of p-methoxyphenol, 140 grams of acrylic acid, and 0.4 grams of triphenylphosphine, and heat while stirring. Control the temperature at 90-120°C for 10 hours, the measured acid value is less than 5, add 260 grams of tetrahydrophthalic anhydride, control the temperature at 90-100°C, react for three hours, the measured acid value is 142, cool to below 60°C. Resin C was obtained as a pale yellow viscous liquid.

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Abstract

The invention relates to a high-temperature-resistant solder resist ink composition, which comprises an alkaline water soluble compound, epoxy resin and an unsaturated double-bond compound, wherein the alkaline water soluble compound is an alkaline water soluble compound containing carboxyl and unsaturated double-bond in the same molecule, wherein the alkaline water soluble compound accounts for 20-80% (in percentage by weight) of the composition, the epoxy resin accounts for 3-20% of the composition; the unsaturated double-bond compound is a compound containing at least one unsaturated double-bond in the molecule, and the unsaturated double-bond compound accounts for 2-15% of the composition. The composition can be cleaned by a rare alkaline water solution without a photocuring condition,so that a perfect high-temperature-resistant solder resist ink coating film is obtained.

Description

technical field [0001] The technical field that the present invention relates to is printed circuit board industry, digital jet printing solder resist ink, specifically relates to a kind of high temperature resistant solder resist ink and its circuit board. Background technique [0002] The photosensitive solder resist ink used in printed circuit boards is commonly used in the process of fully coating the substrate by screen printing, electrostatic spraying or air spraying, and then pre-drying at a temperature of 70-90°C , to volatilize the VOC in the ink to form an ink film layer that is solid at room temperature, then attach a specific light-shielding graphic film to the surface of the ink film, and expose the ink to a set energy through the film, and the photochemical reaction occurs in the part that sees the light, forming The part that is insoluble in the developer and the part that has not been exposed to light can be dissolved in an alkaline aqueous solution, and the ...

Claims

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Application Information

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IPC IPC(8): C09D11/101C09D11/107H05K3/12
CPCC09D11/101C09D11/107H05K3/125
Inventor 王俊峰杨遇春刘启升
Owner 深圳市容大感光科技股份有限公司
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