Stretchable variable micro-channel heat exchanger for cooling machine room

Abstract

The invention discloses a stretchable variable micro-channel heat exchanger for cooling a machine room. The stretchable variable micro-channel heat exchanger comprises a refrigerating unit, a signalacquisition detector, a signal analysis controller, a water cooling system and a plurality of stretchable variable micro-channels, wherein the stretchable variable micro-channels are arranged on a heat dissipation plate of a server host; the refrigerating unit communicates with each stretchable variable micro-channel through a circulating pipeline; each stretchable variable micro-channel comprisesa main groove channel and an auxiliary groove channel which are connected in a sliding mode; the stretchable variable micro-channels can stretch and contract through electronic signals of the signalanalysis controller; and the refrigerating unit controls the variable-frequency charging of the circulating pipelines through the electronic signals of the signal analysis controller. According to the stretchable variable micro-channel heat exchanger for cooling the machine room, through stretchable change of the sectional area of the stretchable variable micro-channel, the heat exchange amount can be increased or decreased with the data accessed by the server host increased or decreased, so that the heat exchange performance of the heat exchanger is changed, heat dissipation requirements ofthe machine room at peak access amount or at the valley access amount are fully met, and the energy-saving, timely and efficient heat dissipation effect are achieved.

Description

technical field [0001] The invention relates to the fields of energy saving and refrigeration, in particular to a telescopic variable micro-channel heat exchanger for heat dissipation in a machine room. Background technique [0002] With the rapid development of the microelectronics field, with the continuous improvement of transistor integration, the heat density of high-speed electronic devices has reached 5-10MW / m 2 , the resulting excessive temperature will reduce the working stability of the chip and increase the error rate. At the same time, the thermal stress formed between the inside of the module and its external environment will directly affect the electrical performance, operating frequency, mechanical strength and reliability of the chip. , so the requirements for efficient heat dissipation of micro components are getting higher and higher. If the micro-component heat dissipation is not handled well, the temperature of the component will rise, which will directl...

AI Technical Summary

Problems solved by technology

Since the frequency conversion technology only realizes the adjustment by changing the filling rate of the cooling fluid, the range and speed of the change are limited

However, the heat dissipation of the mainframe in the computer room increases or decreases sharply in a short period of time with the increase or decrease of the data accessed by the server mainframe. The existing frequency conversion technology cannot adapt to the huge heat dissipation during the peak hours of the computer room and the extremely small heat dissipation during the off-peak period.

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