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A wide temperature and low power consumption integrated light emission component

A technology of light emitting components and low power consumption, applied in the coupling of optical waveguides, etc., can solve problems such as unsatisfactory working requirements, limited working temperature, and limited cooling efficiency, and achieve low power consumption, simple process, and high cooling and heating efficiency high effect

Active Publication Date: 2019-09-10
WUHAN TELECOMM DEVICES
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Under the conditions of the existing technology, the application environment of the integrated EML light emission component is mainly -5 ° C ~ 70 ° C, such as figure 1 , figure 2 , can not meet the working requirements under harsh temperature conditions
The main reasons for not being able to work at a wide temperature are: the passive heat load caused by the heat conduction of the gold wire is too large; multiple materials are bonded together with solder or glue, and the thermal resistance is large, resulting in a limited working temperature; the TEC unit The area cooling efficiency is limited, making the device unable to work under wide temperature (-40°C ~ 85°C) conditions

Method used

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  • A wide temperature and low power consumption integrated light emission component
  • A wide temperature and low power consumption integrated light emission component
  • A wide temperature and low power consumption integrated light emission component

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Embodiment 1

[0043] Embodiment one: if image 3 , Figure 4 , Figure 5 , Figure 6 It is a sectional view of the overall package of the optical device of the present invention. Such as image 3 , Figure 4 , Figure 5 , Figure 6 As shown, the structure of the device of the present invention includes a thermal insulation block 1, a tungsten copper heat sink 2, a thermistor 3, a backlight detector 4, a semiconductor laser chip 5, a transition block 6, a collimating optical unit 7, and a refrigerator 8 (TEC), multiplexing component 9, optical isolator 10, converging optical component 11, pin component 12, tube shell 13, tube cover 14, tube shell 13 refers to a tube shell with a high-frequency transmission line structure, and the shell can be used Cutting material, the bottom of the tube shell is made of tungsten copper, the transmission line structure is composed of multi-layer high temperature co-fired ceramics, the tube shell contains a sapphire sealed light window; the tube cover ...

Embodiment 2

[0046] In the embodiment of the present invention, the backlight detector 4 and the semiconductor laser chip 5 are installed on the first layer cold surface 18 of the refrigerator 8 through a tungsten copper heat sink 2, and the heat emitted by the semiconductor laser chip 5 is directly pumped by the upper layer TEC onto the lower TEC.

[0047] The present invention utilizes a double-layer TEC structure to directly place the laser chip or the ALN transition block installed with the laser chip and the backlight detector on the first layer of TEC. Compared with the traditional packaging structure, the present invention has the following advantages: first, Utilizing the height difference between the first layer and the second layer of TEC, the metal tungsten copper heat sink element used for height control and heat conduction is directly removed, the components of the laser component are reduced, and the assembly process of the component is omitted, which is beneficial to improve ...

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Abstract

Disclosed is an integrated light-emitting assembly with a wide temperature range and a low power consumption, comprising a thermosensitive element (3), a refrigerator TEC (8) and a tube shell (13), wherein the tube shell is provided with a pin; the refrigerator TEC is a double-layer refrigeration unit composed of a second layer cold surface (16), a second layer semiconductor refrigeration element (17), a first layer cold surface (18), a first layer semiconductor refrigeration element (19), and a refrigerator TEC hot surface (20) successively arranged from top to bottom; the thermosensitive element is fixed to the second layer cold surface of the refrigerator TEC; the first layer cold surface is provided with a heat insulator (1) respectively connected to the second layer cold surface and the pin; and the first layer semiconductor refrigeration element is connected to the second layer semiconductor refrigeration element via an electrode. Compared with existing similar device package structures, the double-layer refrigerator TEC structure has a better cooling and heating efficiency per unit area and a lower power consumption, and can also operate in a wider temperature range.

Description

technical field [0001] The invention relates to a light emission component capable of working at -40°C to 85°C with thermoelectric cooling, which is mainly used in 100G optical modules, and belongs to the fields of communication and optoelectronics. Background technique [0002] As 4G enters the stage of large-scale commercial use, the future fifth-generation mobile communication (5G) has become a global research and development hotspot. Starting from the main application scenarios, business requirements and challenges of the mobile Internet and the Internet of Things in the future, the main technical scenarios of 5G have four characteristics: continuous wide-area coverage, high-capacity hotspots, large connections with low power consumption, and high reliability with low latency. Among them, the low-power and large-connection scenarios are mainly for smart cities, environmental monitoring, intelligent agriculture, forest fire prevention and other application scenarios that ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02B6/42
Inventor 宋小平徐红春刘成刚岳阳阳
Owner WUHAN TELECOMM DEVICES
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