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Deeply curable, transparent two-component condensation type silicone adhesive and preparation method thereof

An organic silica gel, condensation-type technology, used in adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve the problems of substrate corrosion, transparency and deep curing properties difficult to meet application requirements at the same time, heavy metal excess, etc. To achieve the effect of meeting application requirements

Active Publication Date: 2020-10-30
GUANGZHOU BAIYUN CHEM IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in order to ensure sufficient deep curing speed, the amount of organic tin catalyst added has reached 1820ppm-13600ppm, there is a serious risk of excessive heavy metals, and at the same time, a higher content of organic tin carboxylate has a risk of corrosion to the substrate
[0004] All in all, the existing condensation adhesive products are difficult to meet the application requirements in terms of transparency and deep curing performance at the same time, and there are still obvious deficiencies, and the technology needs to be further improved

Method used

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  • Deeply curable, transparent two-component condensation type silicone adhesive and preparation method thereof
  • Deeply curable, transparent two-component condensation type silicone adhesive and preparation method thereof
  • Deeply curable, transparent two-component condensation type silicone adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] The two-component condensation type silicone adhesive in this embodiment is composed of A component and B component.

[0036] Component A is prepared from the following raw materials: 100 parts of 500cps α, ω-dihydroxy polydimethylsiloxane (107 glue), 45 parts of methyl silicone resin, 0.5 parts of diethylene glycol, 0.5 parts of l,6- Hexylene glycol, 0.2 parts deionized water.

[0037] The preparation method of component A is as follows: use a high-speed disperser for production. The specific process is to slowly add the reinforcing resin to the 107 glue under high-speed stirring at 950rpm. After the two are thoroughly stirred evenly, add the pre-mixed polyol Slowly add the mixture of quasi-compound and deionized water, continue stirring at 950rpm to disperse at a high speed, and at the same time vacuumize, reach above -0.095MPa within 1min and keep it for 10min, discharge and store in a sealed container.

[0038] Component B is prepared from the following raw materia...

Embodiment 2

[0042] The two-component condensation type silicone adhesive in this embodiment is composed of A component and B component.

[0043] Component A is prepared from the following raw materials: 100 parts of 100cps α, ω-dihydroxy polydimethylsiloxane, 25 parts of methyl silicone resin, 0.55 parts of diethylene glycol, 0.2 parts of glycerin, 0.2 parts of deionized water.

[0044] The preparation method of A component is with embodiment 1.

[0045] Component B is prepared from the following raw materials: 100 parts of 50cps dimethyl silicone oil, 10 parts of ethyl orthosilicate, 4 parts of KH550 silane coupling agent, and 0.2 parts of dibutyltin diacetylacetonate.

[0046] The preparation method of B component is the same as embodiment 1.

[0047] When using, take A component and B component with a mass ratio of 10:1 and mix them well.

Embodiment 3

[0049] The two-component condensation type silicone adhesive in this embodiment is composed of A component and B component.

[0050] Component A was prepared from the following raw materials: 100 parts of 200 cps α, ω-dihydroxypolydimethylsiloxane, 40 parts of vinyl silicone resin, 1.15 parts of diethylene glycol, 0.1 part of pentaerythritol, and 0.3 part of deionized water.

[0051] The preparation method of A component is with embodiment 1.

[0052] Component B is prepared from the following raw materials: 100 parts of 75cps dimethicone, 20 parts of ethyl orthosilicate, 3 parts of KH550 silane coupling agent, and 0.3 parts of dibutyltin diacetoacetate.

[0053] The preparation method of B component is the same as embodiment 1.

[0054] When using, take A component and B component with a mass ratio of 10:1 and mix them well.

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Abstract

The invention relates to double-component condensed type organic silica gel adhesive and a preparing method thereof. The double-component condensed type organic silica gel adhesive comprises a component A and a component B, wherein the component A is prepared from, by weight, 100 parts of alpha, omega-dyhydroxy polydimethylsiloxane, 20-50 parts of reinforcing resin, 0.5-1.5 parts of polyhydric alcohol type compounds and 0.1-0.5 part of deionized water, and the polyhydric alcohol type compounds are selected from at least one of glycerol, diethylene glycol, 1,2-propanediol, 1,3-propanediol, 1,4-butylene glycol, pentaerythritol, neopentyl glycol and l-6-hexanediol; the component B is prepared from, by weight, 100 parts of dimethyl silicone, 5-35 parts of tetraethoxysilane, 1-10 parts of silane coupling agent and 0.1-0.5 parts of organic tin catalyst. The condensed type double-component organic silica gel adhesive product can meet application requirements of transparency and deep curing properties simultaneously.

Description

technical field [0001] The invention relates to the technical field of adhesives, in particular to a deep-curable, transparent two-component condensation type silicone adhesive and a preparation method thereof. Background technique [0002] Transparent condensation-type two-component silicone adhesives are widely used in the bonding and sealing of home decoration, automobile industry assembly, electronic appliances, and LED lamps. These products are superior to addition-type silicone adhesives in terms of adhesion and substrate adaptability . [0003] The A component of the existing transparent condensation type two-component silicone adhesive is composed of various low-viscosity α, ω-dihydroxypolydimethylsiloxane (107 glue) and reinforcing resin, and the B component is A mixture of crosslinking agent, coupling agent and catalyst prepared in a certain proportion. Since component A has almost no water vapor required for condensation crosslinking reaction, the deep curing sp...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J183/04C09J183/07C09J11/06
CPCC08K2201/014C08L2201/10C08L2205/025C08L2205/03C09J11/06C09J183/04C08L83/04C08K5/053C08K5/544
Inventor 江锋蒋金博曾容
Owner GUANGZHOU BAIYUN CHEM IND
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